Cabot Microelectronics Corporation

Jason Aggio

Yuchun Wang

Robert E Medsker

Francesco De Rege Thesauro

John C Parker

Renjie Zhou

Daniel D Woodland

Jason Keleher

Bin Lu

John Parker

Francis De Rege Thesauro

The invention provides compositions and methods for planarizing or polishing a surface. One composition comprises about 0.01 wt. % to about 20 wt. % &#x3b1;-alumina particles, wherein the &#x3b1;-alumina particles have an average diameter of 200 nm or less, and 80% of the &#x3b1;-alumina particles have a diameter of about 500 nm or less, an organic acid, a corrosion inhibitor, and water. Another composition comprises &#x3b1;-alumina particles, an organic acid, dual corrosion inhibitors of triazole and benzotriazole, wherein the wt. % ratio of the triazole to benzotriazole is about 0.1 to about 4.8, and water.

Composition and method for planarizing surfaces

The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing low-k dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, and an aqueous carrier therefor. A CMP method for polishing a low-k dielectric surface utilizing the composition is also disclosed.

Compositions and methods for CMP of low-k-dielectric materials

Growing community of inventors

Bolingbrook, IL, United States of America

Jason Aggio