Intel Corporation

Jason A Mix

Michael W Leddige

Mohamed A Abdelmoneum

Kenneth Foust

Chaitanya Sreerama

Yun Ling

Tae Young Yang

Weston C Roth

Stephen H Hall, Jr

Jayne L Mershon

Renzhi Liu

Olufemi B Oluwafemi

Zhen Zhou

Xang Moua

Paul G Huray

Glen J Anderson

Kai Xiao

Nasser A Kurd

Zuoguo Wu

Jose Rodrigo Camacho Perez

Paulo Lopez Meyer

Hector A Cordourier Maruri

Tarek A Ibrahim

Julio Cesar Zamora Esquivel

Mark Charles Carbone

Maynard C Falconer

Stephen H Hall

Chieh-Yih Wan

Brent R Carlton

Eduardo Alban

Tolga Acikalin

Whitney Michael Bryks

Jong-Ru Guo

Srinivas Venkata Ramanuja Pietambaram

Shuhei Yamada

Catharina Biber

Alok Tripathi

Daqiao Du

Timo Huusari

Earl J Wight

Jose A Sanchez Sanchez

Kent E Mallory

Sarah Shahraini

Joshua Linden Levy

Johanny Escobar Pelaez

Earl Wight

Paul Huray

Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

Antenna assembly for integrated circuit package

An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.

Integrated MEMS resonator and method

A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.

Near field wireless communication system for mother to package and package to package sideband digital communication

Techniques and mechanisms for regulating a temperature of a resonator structure. In an embodiment, a thermoelectric cooler (TEC) is thermally coupled to a resonator which is proximate thereto. The resonator supports operation with an oscillator circuit, wherein a resonance characteristic of the resonator contributes to oscillations of a master clock signal, or other oscillatory signal, which is provided with the oscillator circuit. The TEC provides Peltier functionality to selectively perform either one of heating or cooling the resonator. In another embodiment, the TEC is configured to conduct heat which is transferred via a path between the TEC and the resonator, wherein the path omits any circuitry which is to perform operations which are synchronized based on the oscillatory signal.

Device, system, and method to regulate temperature of a resonator structure

A positioning device and positioning method in which a first wireless signal is transmitted along a first signal path having a first signal path angle that changes relative to time; second wireless signal data representing a response of a wireless station to the first wireless signal is received; a third wireless signal is transmitted along a second signal path; and an assumption that an obstruction is between the wireless communication device and the wireless station is generated if the wireless communication device receives a response from the wireless station to the first wireless signal but does not receive a response from the wireless station to the third wireless signal; wherein the second signal path is a linear path.

Station detection using frequency-diverse array signals

The apparatus includes an apparatus for harvesting energy. The apparatus includes a textile having an insulating substrate, a direct current (DC) power bus structure disposed in the insulating substrate, and multiple transducers. The DC power bus includes a positive conductor and a ground conductor. The transducers are secured to the insulating substrate and in electrical contact with the positive conductor and the ground conductor. Additionally, the DC bus remains conductively coupled to the transducers remaining in the textile after the textile is cut.

Energy harvesting fabric

Techniques for decoding encoded data are described herein. An example of a device in accordance with the present techniques includes a receiving signaling module coupled to a plurality of signal lines. The signaling module includes a receiver to receive a plurality of encoded line voltages or currents on the plurality of signal lines of a bus, wherein each one of the plurality of encoded line voltages corresponds to a weighted sum of data. The signaling module includes a comparator to determine the voltage level of each line at a unit interval and convert the voltage level to a digital value. The signaling module includes a lookup table correlating the digital value with a digital bit stream.

Crosstalk aware decoding for a data bus

Techniques for encoding data are described herein. An example of a device in accordance with the present techniques includes a signaling module coupled to a plurality of digital inputs. The signaling module is to encode data received at the plurality of digital inputs to generate encoded data. Based on the encoded data, the signaling module can drive line voltages on a plurality of signal lines of a bus. Each one of the plurality of line voltages corresponds to a weighted sum of the data received at the plurality of digital inputs.

Crosstalk aware encoding for a data bus

The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.

Apparatus and method for improving coupling across plane discontinuities on circuit boards

Apparatus for improving coupling across plane discontinuities on circuit boards

In one embodiment of the invention, the apparatus includes a socket connector to connect to a backplane to receive an electronic device. The socket connector includes a plurality of pairs of signal contacts to receive signals from the electronic device, and a plurality of ground frames to ground the electronic device. The ground frames are to connect to a ground plane of the electronic device. The socket connector also includes a set of one or more ground pins to connect to the ground plane, wherein each one of the set is between each of the pairs of signal contacts.

Add-in card to backplane connecting apparatus

A technique to simultaneously reduce high-frequency insertion loss and cross-talk for a multi-layered add-in card is disclosed. The technique is based on selective removal of ground and power planes beneath the edge fingers. This selective removal of power and ground planes removes excess capacitance at the edge fingers, lowering the insertion loss at high frequencies, while maintaining an impedance match with an associated connector. Simultaneously, the leftover metallic ground/power plane provides electromagnetic shielding and thus reduces the cross-talk between the differential pairs. Optimum performance of the connector with minimized insertion loss and cross-talk can be obtained for high-speed analog and digital applications.

Add-in card edge-finger design/stackup to optimize connector performance

Growing community of inventors

Hillsboro, OR, United States of America

Jason A Mix