Novellus Systems Incorporated

Jasent Montano

John Derwood Herb

Edmund Minshall

John F Stumpf

Robert Marshall Stowell

Brian Severson

Timothy Patrick Cleary

David T Marquardt

Rand Conner

Kevin Bertsch

James Jed Crawford

Franklin D Root

Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

CMP apparatus and method

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Chandler, AZ, United States of America

Jasent Montano