Corelase Oy

Jarno Kangastupa

Tiina Amberla

Arto K Salokatve

Tuomo Konnunaho

Kazuo Yamada

Arto Salokatve

The invention concerns an apparatus and its use for laser welding. A laser welding apparatus comprise at least one first laser device, each providing at least one first optical feed fiber with a first laser beam; at least one second laser device, each providing at least one second optical feed fiber with a second laser beam; means for generating a composite laser beam comprising a first output laser beam and a second output laser beam for welding a workpiece; wherein the first output laser beam has a circular cross-section and the second output laser beam has an annular shape concentric to the first output laser beam. The second laser device is a fiber laser device or a fiber-coupled laser device. The apparatus is configured to form the second output laser beam at least on the basis of the second laser beam, and the second output laser beam comprises a first wavelength and a second wavelength having difference of at least 10 nanometers, or the second output laser beam has spectrum width of least 10 nanometers.

Laser processing apparatus and method

The invention concerns an apparatus and a method for laser processing. There is provided at least one first laser beam from at least one first optical feed fiber connected to at least one first laser device and at least one second laser beam from at least one second optical feed fiber connected to at least one second laser device. Said first and second laser beams are combined in a multi-core optical fiber. Said first core of said multi-core optical fiber has a circular cross-section, and said second core has an annular shape concentric to said first core. A composite laser beam comprising first and second output beams is directed from said multi-core optical fiber to a workpiece with overlapping elements to be welded.

The invention concerns an apparatus and its use for laser processing. The invention also concerns a method and an optical component. According to the invention, at a first laser device, providing a first optical feed fiber and a second laser device providing a second optical feed fiber is provided. A beam combining means connected to the first and second feed fibers and to a multi-core optical fiber is adapted to form a composite laser beam by having the first optical feed fiber aligned with a first core of the multi-core optical fiber and the second optical feed fiber aligned with at least one second core of the multi-core optical fiber. The first and second cores outputs a composite laser beam to a workpiece to be processed. A control unit controls power density of at least one of first and second laser beams of the composite laser beam in at least one of: in response to approaching a change point in direction of cutting progression and to cause change in relation between the power density of the first output laser beam and power density of the second output laser beam in accordance with thickness of the workpiece being cut.

An apparatus and its use for laser processing along with a method and an optical component. A first laser device provides a first optical feed fiber and a second laser device provides a second optical feed fiber. A beam combining means connected to the first and second feed fibers and to a multi-core optical fiber is adapted to form a composite laser beam by having the first optical feed fiber aligned with a first core of the multi-core optical fiber and the second optical feed fiber aligned with at least one second core of the multi-core optical fiber. The first and second cores outputs a composite laser beam to a workpiece to be processed. A control unit individually controls the power density of the output laser beams.

Laser processing apparatus and method and an optical component therefor

The invention relates to a method and apparatus for processing substrates, such as glass and semiconductor wafers. The method comprises directing to the substrate from a laser source a plurality of sequential focused laser pulses having a predetermined duration, pulsing frequency and focal spot diameter, the pulses being capable of locally melting the substrate, and moving the laser source and the substrate with respect to each other at a predetermined moving velocity so that a structurally modified zone is formed to the substrate. According to the invention, the pulse duration is in the range of 20-100 ps, pulsing frequency at least 1 MHz and moving velocity adjusted such that the distance between successive pulses is less than &#x2155; of the diameter of the focal spot. The invention can be utilized, for example, for efficient dicing, scribing and welding of materials which are normally transparent.

Method and apparatus for processing substrates using a laser

The invention concerns a method of fusing and electrically contacting a first insulating substrate (A) having at least one first conductive layer (A) thereon with at least one second insulating substrate (B) having at least one second conductive layer (B) thereon, the method comprising: stacking the first and second substrates (A,B) such that an interface zone is formed between them, the interface zone comprising an electrical contacting zone where at least one first conductive layers (A) faces and is at least partially aligned with at least one second conductive layer (B), and a substrate fusing zone where the insulating substrates (A,B) directly face each other; focusing to the interface zone of the substrates (A,B) through one of the substrates (A,B) a plurality of sequential focused laser pulses from a laser source, the pulse duration, pulse frequency and pulse power of the laser light being chosen to provide local melting the substrate (A,B) materials and the conductive layers (A,B); and moving the laser source and the substrate with respect to each other at a predetermined velocity and path so that a structurally modified zone is formed to the interface zone, the structurally modified zone overlapping with said electrical contacting zone and said substrate fusing zone. The invention provides a convenient way of manufacturing well-sealed joints and electrical contacts for multifunction electronic devices, for example.

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Tampere, Finland

Jarno Kangastupa