Tactotek Oy

Polar Electro Oy

Jarmo Saaski

Mikko Heikkinen

Antti Keränen

Pasi Raappana

Paavo Niskala

Tero Heikkinen

Kari Matias Severinkangas

Mikko Sippari

Pekka Rytky

Jarkko Torvinen

Elias Pekonen

Seppo Korkala

Juhani Kemppainen

Sami Torvinen

Tuomas Heikkila

Tero Mattinen

An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.

Ecological multilayer structure for hosting electronics and related method of manufacture

Integrated multilayer structure () for hosting electronics, comprising a first substrate () comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (B), a plastic layer (), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

A heart activity sensor structure includes a flexible substrate being substantially non-conductive, at least two electrodes printed on one side of the flexible substrate and configured to be placed against a skin of a user in order to measure biometric signals related to heart activity, and an electrostatic discharge shield printed on opposite side the flexible textile substrate, compared to the printing of the at least two electrodes, for protecting the at least two electrodes from static electricity.

Heart activity sensor structure

A method for manufacturing a multilayer structure for an electronic device includes obtaining a flexible substrate film; printing a number of conductor traces on the flexible substrate film; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further includes a second surface area adjacent to the first surface area; molding first thermoplastic material on the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and molding second thermoplastic material on the adjacent second surface area and on at least part of the first surface area, wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity.

Multi-material structure with embedded electronics

A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.

Multilayer structure for capacitive pressure sensing

A multilayer structure for an electronic device, includes a flexible substrate film () for accommodating electronics, a number of electronic components () provided on a first surface area (A,A) of the film, the film also including a second surface area adjacent (B,B) to the first surface area, and a number of conductive traces () printed on the substrate film for electrically connecting electronic components together, wherein the number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material (), the adjacent second surface area and at least part of the first area being overmolded with second thermoplastic material so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.

A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

Method for manufacturing electronic products, related arrangement and product

A multilayer structure () including a preferably flexible substrate film () capable of accommodating electronics (), such as conductive traces and optionally electronic components such as SMDs (surface-mount device), on a first side thereof, the film having the first side and a second side, and a plastic layer () molded onto the first side of the substrate and protruding at one or more locations (B) through the substrate onto the second side, forming one or more protrusions () on the second side having a predetermined function. A corresponding method of manufacture is presented.

Multilayer structure and related method of manufacture for electronics

A multilayer structure, includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, preferably printed on the first side for establishing a desired predetermined circuit design, plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a preferably flexible connector for providing external electrical connection to the embedded circuit on the first side from the second, opposite side, one end of the connector being attached to a predetermined contact area on the first side, the other end being located on the second side for coupling with an external element, the intermediate portion connecting the two ends being fed through an opening in the substrate, wherein the opening extending through the thickness of the film is dimensioned to accommodate the connector without substantial additional clearance.

Multilayer structure () for electronic devices, including a flexible substrate film () for accommodating electronics, a number of electrical elements () provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer () laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer () molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.

Multilayer structure for accommodating electronics and related method of manufacture

The invention relates to a wrist device, particularly to a fastening mechanism of a cover part and a plastic body part of the wrist device. The fastening mechanism comprises a fastening structure, which in turn comprises a projecting grip structure extending at least partly into the body part, setting against a positioning surface of the body part, and blocked in relation to the mounting direction of the cover part to prevent the fastening structure from moving in a direction opposite to the mounting direction once the fastening structure has been pressed into the body part.

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Kempele, Finland

Jarmo Saaski