Intel Corporation

Jarett L Rinaldi

Patrick D Boyd

Al LaValle

Al La Valle

John C Johnson

Paul J Diglio

Arnab Choudhury

Phi Hung Thanh

A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

Fluid flow channel for enhanced heat transfer efficiency

A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.

Method of making an electrical inductor using a sacrificial electrode

A device and method including a slot insertion member is to hold a number of card edge slots having a plurality of pins extending from them in alignment for insertion of the plurality of pins into a plurality of holes of a printed circuit board. At least one grip attachment member is connected to the plurality of slot insertion members to hold the plurality of slot insertion members in a fixed position. At least one grip member is connected to at least one grip attachment member to enable the holding and positioning of the slot holder.

Apparatus for assembling card edge slots into a substrate

A surface mount device light emitting diode package is provided. The package includes a circuit board housing attached to a printed circuit board. The circuit board housing supports a first light emitting diode and a second light emitting diode. The light emitting diodes are then coupled to the printed circuit board.

Multi-stack surface mount light emitting diodes

A connector to supply power or communications to a printed circuit board having positive thermal coefficient switches embedded in or mounted on the connector. These positive thermal coefficient switches are linked to connector leads that in turn are connected to leads/traces embedded in or on the printed circuit board. The connector using these positive thermal coefficient switches protects the circuitry of the printed circuit board from possible damage.

Integrated connector and positive thermal coefficient switch

An apparatus and methods for attaching a component to a substrate, which allows through-hole mount electronic components to be attached to the substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending). The apparatus is, in general, a socket including a housing having a first surface, a second surface, and an attachment surface. A recess is defined within the housing, wherein the recess comprises a component chamber extending from the housing first surface to a horizontal portion of at least one lead guide channel that extends from the component chamber to the housing second surface. The lead guide channel includes a sloped wall extending from the component chamber toward the lead guide channel. A lid is attached to the housing and adapted to move from an open position to a closed position abutting the housing second surface.

Growing community of inventors

Phoenix, AZ, United States of America

Jarett L Rinaldi