International Business Machines Corporation

Other

Janusz S Wilczynski

Rama Nand Singh

George L Chiu

Fuad Elias Doany

Jane M Shaw

Alan Edward Rosenbluth

Thomas Mario Cipolla

Alfred Viehbeck

David Andrew Lewis

Derek Brian Dove

David F Witman

Evan Ezra Davidson

Sampath Purushothaman

Raymond E Tibbetts

Chandrasekhar Narayan

Bruce Kenneth Furman

Modest M Oprysko

Alina Deutsch

Gnanalingam Arjavalingam

Donald J Hunt

Vincent Ranieri

Stephen Renick

Steven Roy Julien Brueck

Charles Hampton Perry

James N Humenik

James Lewis Levine

Bahgat Ghaleb Sammakia

Douglas S Goodman

Frederick Hayes Dill

Burn J Lin

Bunsen Fan

Richard L Garwin

Saleem H Zaidi

Xiaolan Chen

Tien Y Wu

Andrew Frauenglass

George J Fan

Donis G Flagello

Ekkehard F Miersch

Thomas Ainsworth, Jr

Lawrence S-w Mok

John Sebastian Mentesana

William Godfrey Santy

A lens design having two concave mirrors or Mangins and a turning mirror is disclosed. The optical axis of the concave elements are approximately coplanar and intersect on a turning mirror, and the normal to the surface of the turning mirror bisects the angle between the two optical axis.

Photolithography lens

A lens design having two concave mirrors or Mangins and a turning mirror is disclosed. The optical axis of the concave elements are coplanar and intersect on a turning mirror, and the normal to the surface of the turning mirror bisects the angle between the two optical axis.

A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The packgage allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.

Three dimensional package and architecture for high performance computer

The present invention provides methods and apparatus for defining a single structure on a semiconductor wafer by spatial frequency components whereby some of the spatial frequency components are derived by optical lithography and some by interferometric lithographic techniques. Interferometric lithography images the high frequency components while optical lithography images the low frequency components. Optics collects many spatial frequencies and the interferometry shifts the spatial frequencies to high spatial frequencies. Thus, because the mask does not need to provide high spatial frequencies, the masks are configured to create only low frequency components, thereby allowing fabrication of simpler masks having larger structures. These methods and apparatus facilitate writing more complex repetitive as well as non-repetitive patterns in a single exposure with a resolution which is higher than that currently available using known optical lithography alone.

Methods and apparatus for integrating optical and interferometric lithography to produce complex patterns

An inventive system and method for continually advancing film through an air-bearing film flattening system having at least one scanning area through which the air-flattened film may be scanned. The film is provided to an air-bearing mechanism comprising two opposing air-bearing plates which create opposing air cushions for maintaining the planarity of the film. The scanning area may comprise at least one optical aperture in the air-bearing plate or plates through which the scanner views the film, or a 'viewing' area occupied by bundled coherent optical fibers which sequentially pick up image information from aligned regions of the image. The system provides for time efficient, clean, and error-free reading of the scanned image.

System and method for providing error-free optical scanning of images on

A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.

An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The system includes a quarter wave plate positioned to suppress stray reflection from the projection lens. The system also includes a second quarter wave plate disposed on the screen and a polarizing film disposed on the second quarter wave plate to suppress ambient light from illuminating the screen and entering the system.

Efficient optical system for a high resolution projection display

An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. In particular, the present invention includes a color splitting prism assembly having a plurality of output faces through which a separate color component is directed to be reflected by a respective light valve. Color absorbing filters are disposed at each of the output faces to absorb the color components not corresponding to the color directed through each output face.

An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The illumination system includes a light tunnel having a cross-sectional shape corresponding to the geometrical shape of the spacial light modulator to optimize the amount of light projected onto the screen.

An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system having a light tunnel, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display.

A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.

Method for fabricating multi-layer thin film structure having a

A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection members to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection members can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.

An electronic package having an active cooling system for maintaining a semiconductor chip at approximately a constant temperature by monitoring the present temperature of the chip and varying the air flow over a heat sink in thermal contact with the chip in response to the temperature. In addition, the temperature difference between the semiconductor chip module and a printed circuit board is also monitored to maintain that difference at a preset value. The air flow is varied by a variable speed fan or a variable direction baffle.

Electronic package having active means to maintain its operating

A lens system for a laser scanning apparatus which incorporates two transfer lenses in tandem. The transfer lenses include angular reflecting mirrors, correction lenses, and concave mirrors. The transfer lenses are located between the projection mask and the target of the scanning apparatus wherein the laser beam passed through the projection mask is reflected by an angularly disposed mirror through the first correction lens onto the first concave mirror where it is reflected back through the first correction lens and onto another angularly disposed mirror where the beam is sent to and back from the second concave mirror through the second correction lens and then onto the target.

Growing community of inventors

Ossining, NY, United States of America

Janusz S Wilczynski