Other

Intel Corporation

Anecia LLC

Janusz B Liberkowski

Steven Saeed Nasiri

Zhenfang Chen

Alex Harwit

Jeff Jarfa

Paul Robb

A dental prosthesis has a gum sealing rim that snugly contacts the patient's gum. The cavity formed within the gum sealing rim is accessed by through holes via which a pressurized cleaning fluid may be injected into the cavity. The cleaning fluid swirls around and washes of bacteria and deposits. Through a number of cleaning fluid drains, the cleaning fluid exits again the cavity. An additional drain blocker may be configured such that it blocks the cleaning fluid drains while it is clamped by the patient between the teeth. The resulting pressure build up in the cavity causes the cleaning fluid to squeeze out and clean the sealing interface between the gum sealing rim and the patient's gum.

Dental prosthesis with sealed attachment interface and cleaning fluid access thereto

A base for fixing the safety seating system in a passenger car has an external guiding member that more than equatorially encompasses an internal guiding member for a direct spherical guiding of a removable seated newly born infant. The infant is seated with respect to the geometrical pivoting center and an overall mass axis of the rotating portions such that neck bending and head whip lashing are minimized during a vehicle crash. The encompassing spherical and direct guiding provides for a free impact aligned reorientation of the seated infant unimpeded by adjacent elements of the car that are eventually forced into contact during crash. The direct spherical guiding provides also for a lightweight construction of the rotating portions with low momentum of inertia and consequently high responsiveness of the safety seating system.

Spherically guided safety seating system

A support pin matrix features a number of support pins densely two dimensionally arrayed and individually springily suspended such that a patient's body or body portions may be bedded directly on the support pins. The pins are preferably pressurized by a fluid pressure system for highly balanced contact pressure irrespective the individual pins' load deflection. A control system may provide a pin retraction wave of the support pins. A body resting surface accessing device may be moved across the support pin matrix and beneath a bedded patient in conjunction with the pin retraction wave. The resting surface accessing device may be configured for cleaning, drying, inspecting, irradiating, and/or massaging the body resting surface and/or for maintaining the body support pin matrix. A body carrying net may be retracted and raised in between the body support pins to lift the patient off the support pin matrix.

Patient bedding system with dense matrix or individually suspended directly body supporting pins

Simple and rigid attachment of a child seat to a vehicle seat that is not degraded by the seat's cushioning is provided by a head rest fixture and two latch anchor fixtures combined by an operationally rigid frame structure. The frame structure has horizontal and vertical telescopically adjustable and lockable features to fit the system to varying dimensions of vehicle seats, head rests and child seat latch anchors. The child seat may be attached to the system via an object connecting structure that is combined with the frame structure via an in between damping element. The damping element opposes vehicle vibration eventually induced via the latch anchors on the operationally rigid frame from reaching the child seat.

System for multipoint rigid attachment to a vehicle seat via head rest features and via child seat latch anchors

Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end during its insertion. The funnel sections terminate in narrow hole sections that tightly hold the inserted fiber ends. Having top and bottom plate spaced apart provides for high angular precision of the bonded fiber ends with minimal fabrication effort of the insert. Optical fibers may be combined in linear arrays and simultaneously inserted significantly reducing assembly efforts. The insert is attached to a fiber housing and hermetically sealed within an external housing, which features a glass plate to provide beam propagation to and from the fiber ends. An optical gel fills the gap between the insert's output face and the glass plate.

Apparatus for holding a fiber array

A rotatable vacuum chamber receives an optical connector having an output face on which an optical gel is applied substantially without entrapped air. Opposite the output face is placed a gel dispenser with its opened nozzle pointing towards the output face. Uncured gel components contained in the dispenser are outgased prior to application of the gel on the output face while a vacuum is maintained in the chamber. Outgasing takes place at a first chamber orientation with the nozzle pointing upwards through which the outgasing air ventilates. The gel is applied at a second chamber orientation where the output face is horizontal and upwards pointing. Immediately following the gel application, the vacuum is unmade to prevent cooking of the mixed and uncured gel. A glass plate is then pressed against the applied fluid gel.

Method and apparatus for applying a gel

The present invention is directed towards a focus-position compensator for reducing focus variations on a microlens array. The focus-position compensator comprises a plurality of tiles that are affixed to a structure disposed between the lenslets of the microlens array and the target of the collimated light from the lenslets. Each tile refractive index and tile thickness is chosen to obtain a tile focus-position correction that will apply to a region of the microlens array.

Focus-position compensator

An interconnect structure with an interconnect stack consisting of a number of alternating conductive planes and insulating planes. The stack has a number of conductive elements such as conductive vias extend generally normal to the conductive insulating planes of the stack and a number of profiled apertures having geometrical shapes such that they define fuse links in one or more of the conductive planes. The fuse links have a steeply narrowed waist, such that a fusing current I passing through the fuse link produces a fused break substantially at the steeply narrowed waist. Profiled apertures can also be used to define anti-fuse links in interconnect structures such that passing an anti-fusing current I through the anti-fuse link produces a fused joint substantially at the steeply narrowed waist.

Interconnect structure having fuse or anti-fuse links between profiled apertures

Method and apparatus for interconnecting integrated circuits (ICs) are described. The invented lattice is formed in a plural-layer structure whereby each required interconnect signal has one or more dedicated layers of a planar, thin-film conductor coextensive with the substrate. Thousands of such horizontal layers are vertically stacked in the structure, each being shielded by voltage or ground planes and insulated by layers of dielectric material. A regular array of vertical pillars is provided in the substrate, each pillar providing an inner conductor electrically connected with a conductive layer or electrically insulated by an insulative region. The columns extend from the top of the substrate on which the ICs are mounted through to the bottom surface of the bottom layer. The pillars may be selectively disconnected from the layers by fusing techniques, or, alternatively, the pillars may be selectively connected to the layers by anti-fusing techniques. In one embodiment, the interconnection region between a pillar and a layer is switchably programmable to either interconnect or disconnect via a semiconductor switching device such as a transistor fabricated in the lattice interconnect structure, whereby each pillar's interface with each layer may be selectively and alterably defined as being conductive or insulative. Preferably, each column includes a bonding pad on the upper surface for mounting or wire bonding of selected I/O contacts of the ICs. Voltage and ground planes may be rendered in the same substrate by fusing or anti-fusing of selected vias so they are electrically connected with a given plane representing a voltage or ground, which may be performed by forming vias and selectively plating, by photolithography.

Lattice interconnect method and apparatus for manufacturing multi-chip

Method and apparatus for interconnecting integrated circuits (ICs) are described. The invented lattice preferably is formed in a plural-layer structure whereby each required interconnect signal has one or more dedicated layers of a planar, thin-film conductor that is coextensive with the substrate. Thousands of such horizontal layers are vertically stacked in the structure, each being shielded by voltage or ground planes and each being insulated by layers of insulative dielectric material. A regular array of vertical pillars is provided in the substrate, each pillar effectively providing an inner conductor either electrically connected with a conductive layer or electrically insulated therefrom by an insulative region. The columns extend from the top of the substrate on which the ICs are mounted through to the bottom surface of the bottom layer. The pillars may be selectively disconnected from the layers by fusing techniques, or, alternatively, the pillars may be selectively connected to the layers by anti-fusing techniques. In one embodiment, the interconnection region between a pillar and a layer is switchably programmable to either interconnect or disconnect via a semiconductor switching device such as a transistor fabricated in the lattice interconnect structure, whereby each pillar's interface with each layer may be selectively and alterably defined as being conductive or insulative. Preferably, each column includes a bonding pad on the upper structure surface for surface mounting or wire bonding of selected I/O contacts of the ICs. Voltage and ground planes may be rendered in the same substrate by a technique involving the fusing or anti-fusing of selected vias so that they are electrically connected with a given plane representing a voltage or ground potential. Such also may be performed by forming vias and selectively plating them through, as by photolithographic techniques, to produce the desired connections.

Signal-routing or interconnect substrate, structure and apparatus

Single-row roller skates with widened parameters of movement for figure skating on dry surfaces as on ice, said skate comprising a rigid foot plate mounted on spatial cylindrical body of circular cross section, said body has supports for rotating bearings in horizontal axis of motion and has bung (stop) housings extended on both ends for mounted bearing elements and on them supports for twin-carrier yokes having near the supports of said bearing elements spring elements of regulated brakes remaining in elastic contact with rotating brake surfaces of bungs also having on their opposite ends on shoulders formed spatial yokes, said yokes in horizontal static position form supports for vertical auxiliary eliptical surface rollers, said bi-plane yokes interconnected for mounting front and rear main bearings of skate rollers, said rollers have generating surfaces of coaxial microgrooves, said grooves parallel to plane of roller rotation in direction of travel; said skate has distinctive length between axes of front and rear rollers, said length depends on length of skater's foot and is adjustable by mechanism for change of skate length and blocking by frictional resistance.

Growing community of inventors

San Jose, CA, United States of America

Janusz B Liberkowski