Motorola Corporation

Freescale Semiconductor,inc.

Other

Motorola Mobility LLC

Janice M Danvir

Jing Qi

Nadia Yala

Tomasz L Klosowiak

Krishna D Jonnalagadda

Francesca Schuler

Katherine M Devanie

Prasanna Kulkarni

Marc Kenneth Chason

Swee Mean Mok

Robert Kenneth Doot

Chi-Haur Wu

David A Hume

Zhaojin Han

A method and wireless communication device are provided for managing information associated with purchases of active lifestyle products. The method includes receiving a notification () indicating a purchase transaction associated with at least one radio frequency ID enabled item. The notification is analyzed () and in response to the analyzing a user identifier corresponding to a user related to the purchase transaction is determined (). A radio frequency ID associated with the at least one radio frequency ID enabled item is also determined (). A wireless device () associated with the user is identified based on the user identifier (). An information set associated with the at least one radio frequency ID enabled item is transmitted () to the wireless device (). The information set includes at least the radio frequency ID associated with the at least one radio frequency ID enabled item.

Dynamic updating of product profiles for active lifestyles

A method, wireless communication device, and radio frequency ID reader are provided for monitoring radio-frequency identification enabled items. The method includes receiving a set of radio frequency IDs () representing a set of radio frequency ID enabled items () to be monitored. An identifier representing a user activity and its relationship with at least one radio frequency ID in the set of radio frequency IDs and at least one radio frequency ID reader is received (). The method also includes determining if at least one condition associated with the user activity has occurred indicating that the user activity is occurring (). The set of radio frequency IDs representing a set of radio frequency ID enabled items () to be monitored by the at least one radio frequency ID reader are monitored () in response to the determining that the at least one condition is occurring.

Monitoring for radio frequency enabled items based on activity profiles

A self supported underfill film () adhesively bonds surface mount integrated circuit packages () to a printed circuit board (). The printed circuit board has conductive traces () and exposed conductive pads () on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads () on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

Underfill film for printed wiring assemblies

A method and apparatus are provided to aide in emergency egress of a structure. More particularly, egress indicators are co-located with hazard sensors. During detection of a hazard condition, locations of sensors detecting the hazard are identified and a pathway directing traffic away from the hazard is determined. Finally, the egress indicators are operated to direct traffic down the determined pathway.

Method and apparatus to aide in emergency egress

An interface block () carries a removable electrical connection () that can be quickly connected and removed from a high speed machine for picking and placing electronic components. The interface block is attached to a vacuum ported tool changer () which further couples to a heated end effector () to create a removable heated nozzle assembly (). The entire assembly can be easily plugged into and removed from a high speed placement machine.

Heated nozzle assembly

The invention provides a method of attaching an area-array device such as a bumped flip chip to an electrical substrate. An underfill material is applied to a portion of the electrical substrate, and the underfill material is heated to an underfill-material staging temperature. A bumped area-array device is provided, the bumped area-array device including an interconnection surface and a plurality of connective bumps extending from the interconnection surface. The interconnection surface of the bumped area-array device is positioned adjacent the applied underfill material. The bumped area-array device is heated to electrically connect the connective bumps to the electrical substrate. The invention also provides a flip-chip assembly and a printed wiring board panel with pre-applied underfill material.

Area-array device assembly with pre-applied underfill layers on printed wiring board

The invention provides a method for attaching a flip chip to an electrical substrate such as a printed wiring board. A bumped flip chip is provided, the flip chip including an active surface and a plurality of connective bumps extending from the active surface, each connective bump including a side region. A thin layer of an underfill material is applied to the active surface of the flip chip and to a portion of the side regions of the connective bumps. The flip chip is positioned on the electrical substrate, the electrical substrate including a thick layer of a solder mask disposed on the electrical substrate. The flip chip is heated to electrically connect the flip chip to the electrical substrate, wherein the underfill material and the solder mask combine to form a stress-relief layer when the flip chip is electrically connected to the electrical substrate.

Flip-chip assembly with thin underfill and thick solder mask

A bumped semiconductor device ( ) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps ( ) and a coating of underfill material ( ) on one face. A fluxing composition ( ) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated ( ) by selected wavelengths of light.

Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system

A method for providing an underfill material on an integrated circuit chip at the wafer level. The wafer ( ) typically contains one or more integrated circuit chips ( ), and each integrated circuit chip typically has a plurality of solder bumps ( ) on its active surface. The wafer is first diced ( ) on the active surface side to form channels ( ) that will ultimately define the edges ( ) of each individual integrated circuit chip, the dicing being of such a depth that it only cuts part-way through the wafer. The front side ( ) of the wafer is then coated ( ) with an underfill material ( ). Generally, a portion ( ) of each solder bump remains uncoated, but in certain cases the bumps can be completely covered. The back side of the wafer is then lapped, ground, polished or otherwise treated ( ) so as to remove material down to the level of the previously diced channels. This reduction in the thickness of the wafer causes the original diced channels to now extend completely from the front side to the back side of the wafer. The wafer is then singulated ( ) by cutting the underfill material ( ) that was deposited in the channels during the coating step, so that the integrated circuit chip ( ) is released from the wafer, and the underfill material that was coated on the active side remains affixed to the active surface of each individual integrated circuit chip.

Growing community of inventors

Arlington Heights, IL, United States of America

Janice M Danvir