Knowles Electronics, Inc.

Starkey Laboratories, Inc.

Janice LoPresti

Usha Murthy

Steve Kearey

Tao Zhang

Thomas E Miller

Daniel Max Warren

Charles Bender King

Alexander Grossman

Gwendolyn P Massingill

Zhang Tao

A microphone assembly can include a microelectromechanical systems (MEMS) form-factor adapter housing including an interface opening and an adapter housing acoustic port and a MEMS microphone disposed at least partially within the MEMS form-factor adapter housing. The MEMS microphone can include a MEMS microphone housing comprising a MEMS microphone acoustic port; a plurality of electrical interface contacts physically accessible through the interface opening of the MEMS form-factor adapter housing; a MEMS motor disposed in the MEMS microphone housing; and an integrated circuit disposed in the MEMS microphone housing and electrically coupled to the MEMS motor and to the plurality of electrical interface contacts. The MEMS form-factor adapter housing can change a form-factor of the MEMS microphone housing.

Adapters for microphones and combinations thereof

An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.

Acoustic sensor assembly having improved frequency response

A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a microelectromechanical systems (MEMS) motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.

A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.

A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.

A method for measuring sound pressure at a tympanic membrane of a wearer's ear including a high frequency range with a hearing assistance device. The hearing assistance device comprises a processor connected to a sensor in the ear canal. The device provides a measure of the sound pressure level at the tympanic membrane of the wearer using a null frequency and a null Q measured at a distant position away from the tympanic membrane. The method does not require a precise knowledge of the ear canal, nor does it require an elaborate calibration step. In various embodiments, the present approach works at low and high frequencies.

Method to estimate the sound pressure level at eardrum using measurements away from the eardrum

A receiver module for a personal listening device to be fitted in the ear, on the ear, near the ear, or behind the ear, the receiver module having a movable armature, the receiver module comprises a motor assembly and a housing defining a chamber, the housing is made from a material that is corrosion resistant and is biocompatible to human skin contact. The receiver module further comprises at least one motor assembly directly disposed in the chamber. Optionally a communication link adapted to couple or decouple with the motor assembly. At least a portion of the communication link is disposed in the housing.

Growing community of inventors

Itasca, IL, United States of America

Janice LoPresti