Samsung Electronics Co., Ltd.

Jang-Woo Ryu

Hyung-Jin Kim

Ho-Cheol Lee

Chul-Sung Park

Kyung-Ryun Kim

Gong-Heum Han

Hui-Kap Yang

Tae-Seong Jang

Yoon-Na Oh

So-Young Kim

Dong-Hyuk Lee

Hoi-ju Chung

Jung-Sik Kim

Hangi Jung

Jung Sik Kim

Soojung Rho

Young-Dae Lee

Jung Joo Lee

Jung-bae Lee

Tae-Young Oh

Jae-Wook Lee

Kyungryun Kim

Chi-Sung Oh

Chang-Yong Lee

Daehyun Kwon

Chan-yong Lee

Seunghwan Hong

Min-soo Jang

Hyunah An

Ho Cheol Lee

Huikap Yang

Sanguk Lee

Soo Hwan Kim

A clock signal synchronization circuit includes a delay line configured to delay an input clock signal in response to a delay control signal to output an output clock signal, a replica circuit configured to delay the output clock signal to output a feedback clock signal, a phase detector configured to compare the input clock signal and the feedback clock signal with each other to detect a phase difference, and a delay control circuit configured to generate the delay control signal based on the phase difference. The replica circuit may delay the output clock signal based on an operation mode of a memory device to output the feedback clock signal.

Clock signal synchronization circuit, semiconductor memory device including clock signal synchronization circuit, and method of operating clock signal synchronization circuit

A semiconductor device includes a chip select signal flip-flop configured to: latch a chip select signal in-sync with a first propagation clock signal, and output a first chip select enable signal, and latch the chip select signal in-sync with a second propagation clock signal having a phase opposite to a phase of the first propagation clock signal, and output a second chip select enable signal; and a clock control circuit configured to generate the first propagation clock signal and the second propagation clock signal based on a clock signal, and selectively output one of the first propagation clock signal and the second propagation clock signal based on an enable level of the first chip select enable signal and an enable level of the second chip select enable signal.

Semiconductor memory device capable of synchronizing clock signals in CS geardown mode

An integrated circuit memory device includes a serializer configured to convert a plurality of bits of parallel read data, which are synchronized with a corresponding plurality of clock signals that are out-of-phase relative to each other, into a serial stream of the read data. This conversion is performed using a Boolean logic circuit, which is configured to receive each of the plurality of bits of parallel read data and each of the plurality of out-of-phase clock signals at corresponding inputs thereof.

Semiconductor memory devices having efficient serializers therein for transferring data

A method includes replacing an address of a first normal memory cell in a first column of a first memory block with a destination address that is an address of a second normal memory cell in a second column of the first memory block, and reassigning the address of the second normal memory cell in the second column of the first memory block to an address of a first redundancy memory cell in a redundancy block of the memory device.

Semiconductor memory devices, memory systems, and methods of operating semiconductor memory devices

A memory device includes a delay locked loop (DLL), a clock compensating circuit, and a data input/output (I/O) circuit. The DLL outputs a first clock signal and a second clock signal. The clock compensating circuit adjusts a voltage level of an output node and generates an inner clock signal based on the voltage level of the output node. The data I/O circuit outputs data to an outside based on the inner clock signal. The clock compensating circuit includes first and second pulse adjusting circuits. The first pulse adjusting circuit connected to a first output node and outputs a first adjusting current based on the first clock signal and a voltage level of the first output node. The second pulse adjusting circuit connected to a second output node and outputs a second adjusting current based on the second clock signal and a voltage level of the second output node.

Compensating circuit for compensating clock signal and memory device including the same

Disclosed is a level shifter. The level shifter includes a level shifting circuit, a first adjusting circuit, and a second adjusting circuit. The level shifting circuit determines whether to output a first current from a supply voltage line to an output node based on a voltage level of a first node and determines whether to output a second current from the supply voltage line to a third node based on a voltage level of a second node. The first adjusting circuit blocks an output of a third current from the third node to the first node when a clock signal having a first voltage level is received. The second adjusting circuit outputs a fourth current from the first node to a ground voltage line when the clock signal having the first voltage level is received.

Electronic device including level shifter

A semiconductor memory device includes a cell array that includes a first row block and a second row block, a bit line sense amplifier block that senses data stored in the first row block or the second row block, a local sense amplifier that latches the sensed data transferred from the bit line sense amplifier block, and a switch that connects the local sense amplifier with a selected one of a first global data line and a second global data line in response to a select signal. The second row block may be placed at an edge of the cell array, and the switch connects the local sense amplifier with the first global data line when the first row block is activated and connects the local sense amplifier with the second global data line when the second row block is activated.

Semiconductor memory device and data path configuration method thereof

A semiconductor memory device comprises a memory cell array and a data inversion circuit. The data inversion circuit is configured to receive a first unit data and a second unit data stored in the memory cell array through different first data lines, determine, while the first unit data is transmitted to a data input/output (I/O) buffer through a second data line, whether to the invert the second unit data based on a Hamming distance between the first unit data and the second unit data, and transmit the inverted or non-inverted second unit data to the data I/O buffer through the second data line.

Semiconductor memory device, memory system, and method using bus-invert encoding

A method of operating a memory device includes: generating an internal read command in response to a received masked write command, the internal read command being generated one of (i) during a write latency associated with the received masked write command, (ii) after receipt of a first bit of masked write data among a plurality of bits of masked write data, and (iii) in synchronization with a rising or falling edge of a clock signal received with an address signal corresponding to the masked write command; reading, in response to the internal read command, a plurality of bits of data stored in a plurality of memory cells, the plurality of memory cells corresponding to the address signal; and storing, in response to an internal write command, the plurality of bits of masked write data in the plurality of memory cells.

Memory devices that perform masked write operations and methods of operating the same

In one embodiment, the semiconductor device includes a memory array and a control architecture configured to control reading data from and writing data to the memory array. The control architecture is configured to receive data and a codeword location in the memory array, select one or more data units in the received data based on a data mask, read a codeword currently stored at the codeword location in the memory array, error correct the read codeword to generate a corrected read codeword, form a new codeword from the selected data units of the received data and data units in the corrected read codeword that do not correspond to the selected data units, and write the new codeword to the memory array.

Semiconductor memory devices, memory systems including the same and method of writing data in the same

A method of operating a semiconductor memory device is disclosed. The method may include receiving an access command, applying a first voltage to a selected word line of the semiconductor memory device for a period of time in response to receiving the access command, applying a second voltage to word lines adjacent to the selected word line before and after the period of time, and applying a third voltage to the word lines adjacent to the selected word line for the period of time, a voltage level of the third voltage greater than the second voltage. The applying the third voltage may occur when the semiconductor memory device is operated at a temperature below the predetermined temperature.

Semiconductor memory device and method of operating the same

A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.

Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof

Multi-channel semiconductor integrated circuit devices are provided including a plurality of memory devices that are independently accessible, each of the plurality of memory devices including at least one power generation unit and a control unit for controlling an operation of the at least one power generation unit, a detection unit for detecting an operation state of the plurality of memory devices, and a common control unit for commonly controlling an operation of the at least one power generation unit of the plurality of memory devices, according to the operation state of the plurality of memory devices detected by the detection unit. The control unit of each of the plurality of memory devices controls the operation of the at least one power generation unit of a corresponding one of the plurality of memory devices.

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Seoul, South Korea

Jang-Woo Ryu