Samsung Electronics Co., Ltd.

Jang-Woo Lee

Donghan Kim

Han-jun Sung

Jae-ryong Park

Tae-uk Lee

Jong-bo Shim

Kyoung-sei Choi

Dae-Young Choi

Jung-Do Lee

Tae-woo Kang

Yang-Hoon Ahn

A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.

Semiconductor packages having a guide wall and related systems and methods

A stack type semiconductor package includes: a lower semiconductor package including a lower package substrate, and a lower semiconductor chip which is mounted on the lower package substrate and includes a first surface facing a top surface of the lower package substrate and a second surface opposite to the first surface; an upper semiconductor package including an upper package substrate and an upper semiconductor chip which is mounted on the upper package substrate; an inter-package connection unit which connects the lower package substrate and the upper package substrate; a heat dissipation member which is formed on the second surface of the lower semiconductor chip; and an interconnection unit which is formed on a bottom surface of the upper package substrate, and is adhered to the heat dissipation member to connect the lower semiconductor chip and the upper package substrate.

Stack type semiconductor package

A bread maker having upper and lower rollers, a baking tray, a housing forming an oven chamber, a door attached to the front of the housing, a baking tray detachably mounted in the oven chamber, and a sensor. The sensor senses whether the baking tray is mounted in the oven chamber. The sensor is mounted in at least one of the housing and the door and moves back and forth a predetermined distance depending on contact with the baking tray. A sensing switch which senses the movement of the sensor.

Bread maker

Growing community of inventors

Cheonan-si, South Korea

Jang-Woo Lee