Samsung Electronics Co., Ltd.

Jang-Sun Kim

Seungchul Lee

Hun-Kyo Seo

Soon-Geol Hwang

Il Jin

A vacuum socket includes a lower housing including a concave portion with a first hole, the concave portion having a recessed cross section and a printed circuit board in the concave portion, wherein the printed circuit board includes a second hole coupled to the first hole and pads provided along an edge region thereof, a cover provided in the concave portion to cover the printed circuit board, and a vacuum pad inserted in the first hole, the vacuum pad having a third hole coupled to the second hole, wherein the printed circuit board is electrically connected to a first semiconductor chip loaded between the printed circuit board and the cover, via the pads.

Vacuum socket and semiconductor testing system including the same

A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.

Contact apparatus and semiconductor test equipment using the same

Exposure equipment useful in the manufacture of semiconductor devices and a related method of operation are disclosed. The exposure equipment directs light through a reticle and an optical system positioned above a wafer onto a target portion of the wafer, and the wafer is rapidly transferred under the directed light to irradiate substantially the entire surface of the wafer. Recursive compensation for undesired movement of the reticle and optical system caused by the rapid transfer of the wafer is provided.

Growing community of inventors

Seoul, South Korea

Jang-Sun Kim