Samsung Electronics Co., Ltd.

Jang-Hyeok Lee

Dae-Woo Kim

Wook-Sung Son

Kwang-Woon Lee

Dae-Man Seo

Heat treatment equipment and a method of driving the same are provided. The heat treatment equipment includes: a process tube having an aperture at one side thereof; a sealing unit for opening or closing the aperture; and a pressure sensor for measuring sealing pressure between the sealing unit and the one side of the process tube. In the heat treatment equipment, the aperture of the process tube can be sealed according to the sealing pressure of the sealing unit so that the process tube can be precisely sealed.

Heat treatment equipment and method of driving the same

An inspection system for inspecting a wafer and an inspection method thereof are provided. The inspection system includes a rotating means for turning and arranging a wafer to an inspection position, an angle measuring means for measuring a rotational angle used by the rotating means to rotate to the inspection position, an inspection apparatus for acquiring inspection data associated with the wafer, and a controller for determining an amending angle from the rotational angle and for amending the inspection data in accordance with the amending angle to calculate amended inspection data, wherein the amended inspection data reflects a state of the wafer on the rotating means.

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Suwon-si, South Korea

Jang-Hyeok Lee