Motorola Corporation

Optoic Technology, Inc.

Jang-Hun (James) Yeh

Karl W Wyatt

Austin Vincent Harton

James J Morikuni

Sean Xin Wu

Xueya Wen

Jinhui Zhai

Samuel Anderson

Daniel R Schroeder

James K Gehrke

Robert R Kornowski

Alan G Chen

Chao-pin Yeh

John R Welk

Paul G Alonas

Gerald W Ballard

Terry L Rohde

John Bliss

Hans R Merz

Wayne C Kramer

An optical interconnect system includes a stacked arrangement of optical lightpipe layers, one layer assigned to each emitter of the system. The various optical lightpipe layers are designed to provide the same level of light to each receptor of the system. The optical lightpipe layers are very thin, allowing the emitter and receptor devices of the system to span the entire optical lightpipe layer assembly. The path loss between every emitter and every receptor over the entire system can be balanced, i.e., made substantially the same, or otherwise set as desired with respect to individual emitters and receptors.

Optical interconnect system with layered lightpipe

A optoelectronic module comprises one or more VCSELs electrically connected to an IC and optically connected to a fiber optic faceplate. The fiber optic faceplate, comprising a closely packed bundle of optical fibers, permits efficient capture of light from the VCSELs. Precise alignment of the faceplate with respect to the VCSELs is not needed since light not collected by one fiber is captured by another nearby optical fiber. One method of fabricating the module comprises forming substrate layers on both sides of the VCSELs such that features can be formed on the first substrate layer while the second temporary substrate layer provides structural support. The method further comprises forming apertures on the first substrate layer by etching. An etch stop buffer layer positioned between the first substrate layer and the VCSELs protects the VCSELs from being etched in the process. The second temporary substrate layer is removed after the fiber optic faceplate is mounted on the first substrate side. An alternate method of VCSEL fabrication comprises forming an aperture by patterning a dielectric layer above an active layer within the VCSEL. The aperture in the dielectric layer can be formed with a high degree of precisely using conventional patterning techniques. The dielectric layer is part of a current confinement element that concentrates current in an active region. A top DBR can also be formed of multiple layers of dielectric.

Methods of fabricating optoelectronic IC modules

Optoelectronic IC module

The present invention provides a method, device and optical package (10,22) for enhancing a temperature stability by controlling a variable characteristic of an optical package and optical interconnect system. The device includes an optical emitter (14) for generating a predetermined beam of light (16) having a predetermined wavelength, a photo-sensing unit (20) for receiving a portion (18) of the predetermined beam of light (16), and a stability-enhancing broad bandwidth holographic optical element (12), wherein the predetermined wavelength of the predetermined beam of light substantially coincides with a working range wavelength of a broad bandwidth of the stability-enhancing broad bandwidth holographic optical element (12), for enhancing the temperature stability of the optical package and the optical interconnect system in response to changes in a thermal expansion of the stability-enhancing broad bandwidth holographic optical element (12) and the changes in the predetermined wavelength of the predetermined optical beam caused by temperature variations.

Method, device and optical package with enhanced temperature stability

The present invention provides a method and multi-channel optical interconnect device (28) including an optical substrate (29) including a first optical channel (30) having a first predetermined thickness, a second optical channel (32) having a second predetermined thickness, and an optically isolating intermediate section (34) connected to the first optical channel (30) and to the second optical channel (32), the optically isolating intermediate section (34) having a third predetermined thickness, wherein the third predetermined thickness is less than either of the first predetermined thickness and the second predetermined thickness for minimizing optical cross-talk between the first optical channel (30) and the second optical channel (32).

Method, multi-channel optical interconnect device, and a multi-channel

The present invention provides a low cost, efficient vertical cavity surface emitting laser package (300) and manufacturing method, the package having a head assembly having at least three leads, a vertical cavity surface emitting laser die bonded to a top surface of the head assembly, for generating a beam of light, and a photodiode, die bonded to the top surface of the head assembly proximate to the vertical cavity surface emitting laser for receiving at least a portion of the beam of light, and generating feedback for adjusting an electrical input current to the vertical cavity surface emitting laser based on a received optical power of the portion of the beam of light received. The vertical cavity surface emitting laser and the photodiode are injection molded in a predetermined shape with a recessed area for placement of a partially reflective holographic optical element/reflector.

Low cost, efficient vertical cavity surface emitting laser package,

A holographic optical interconnect system (100) and method (200) provide flexible, efficient interconnection of a plurality of circuit boards CBs and a plurality of integrated circuit chips. Each CB has at least an optically transparent substrate OTS mate parallel to the CB and extending outside a CB holder. Each OTS mate has parallel sides and carries at least two holographic optical elements HOEs. A first one of the HOEs on a first OTS mate reflects at least a predetermined portion of a first light beam transmitted by a transmitter on a corresponding CB to another HOE, which transmits a received light beam via free space outside the CB holder. On another OTS mate, two HOEs are utilized to receive and direct at least part of the light beam received to a detector on a corresponding CB via free space within the circuit board holder or reflection within the OTS mate.

Holographic optical interconnect system and method for board-to-board

The present invention provides a manufacturing process (600) and method (500) for efficiently providing a multi-holographic optical element substrate unit. Upon preparation of an original continuous/non-continuous holographic optical element with uniform diffraction efficiency and marking the original continuous/non-continuous holographic optical element with predetermined alignment marks, the original continuous/non-continuous holographic optical element is cut into a predetermined number of individual holographic optical elements in accordance with the predetermined alignment marks. Then a substrate is prepared with alignment marks in accordance with the predetermined alignment marks of the individual holographic optical elements, and the individual holographic optical elements are attached to a substrate in accordance with the alignment marks.

Hologram manufacturing process and method for efficiently providing a

An optical isolator (10) includes an opto-electronic emitter (16) and an opto-electronic detector (17) mounted over offset portions (12, 13) of a leadframe (11). The offset portions (12, 13) form angles (14, 15) with other portions (24, 25) of the leadframe (11). An optically transmissive material (22) encapsulates the opto-electronic emitter (16) and the opto-electronic detector (17), and a reflective material (20) is located above the opto-electronic emitter (16) and the opto-electronic detector (17). An optically insulative packaging material (26) encapsulates the optically transmissive material (22).

Optical isolator having leadframe with non-planar mounting portions

An opto-isolator (10) increases optical efficiency by using holographic elements (22,24,26) to direct a beam of light (34) through an optical waveguide (20). An opto-electronic transmitter (12) and receiver (16) are connected to the waveguide to be in alignment with the beam of light reflected by the holographic elements. The transmitter and receiver are disposed on separate leadframe portions (14,18), and the opto-isolator is surrounded by a package (32).

Growing community of inventors

Streamwood, IL, United States of America

Jang-Hun (James) Yeh