Samsung Electro-mechanics Co., Ltd.

Sungkyunkwan University

Jang Ho Park

Jung Ryoul Yim

Young Key Kim

Nam Keun Oh

Ki Won Suh

In Hyun Jang

Jae Young Choi

Jin Uk Lee

Sung Ho Lee

Jong Pil Lee

Doo Ho Park

Heung Bok Ryu

Katsushi Yasuda

Su Dong Chae

Jong Beom Jeon

Yun Gab Choi

Yong Suk Kim

Yoo Sam Na

Young Sik Hur

Seong Jong Cheon

Jae Hyouck Choi

Woon Chun Kim

Tae Hyeok Kim

Seung Joo Shin

Kyoung Soo Chae

Se Jong Kim

Yun Ki Hong

Jang Seok Yun

Kang Ta Jo

Jin Man Han

Jae Chan Park

Ho Taek Song

Jong Yeol Jeon

Jeong Yub Lee

Jung Ryoul Lim

Sung Jun Kim

A front-end module includes: a substrate including a first connection member in which at least one first insulating layer and at least one first wiring layer are alternately stacked, a second connection member in which at least one second insulating layer and at least one second wiring layer are alternately stacked, and a core member disposed between the first and second connection members; a radio-frequency component mounted on a surface of the substrate and configured to amplify a main band of an input RF signal or filter bands outside the main band; an inductor disposed on a surface of the core member and electrically connected to the radio-frequency component; and a ground plane disposed on another surface of the core member. The core member includes a core insulating layer thicker than an insulating layer among at least one first insulating layer and the at least one second insulating layer.

Front-end module

A method of preparing hydrophobic porous silica includes reacting a porous silica particle containing a hydrophilic group in a solvent with an organosilane compound under a basic catalyst to form a mixture, drying the mixture comprising the porous silica particle in a vacuum, and condensation reacting the hydrophilic group of the porous silica particle with the organosilane compound on the surface of the porous silica particle to modify the surface of the porous silica particle to be hydrophobic.

Method of preparing hydrophobic porous silica and hydrophobic porous silica

A method of preparing hydrophobic porous silica includes adding an alcohol to a solvent in which a porous silica particle including a hydrophilic group is dispersed and stirring the same to form a mixture, drying the mixture including the porous silica particle in a vacuum, and condensation reacting the hydrophilic group of the porous silica particle with the alcohol on the surface of the porous silica particle to modify the surface of the porous silica particle to be hydrophobic.

Hydrophobic porous silica and method of preparing hydrophobic porous silica

A bulk acoustic wave filter device includes a substrate including an insulating layer, a resonance portion including a bottom electrode, disposed on the substrate, a piezoelectric layer, disposed above at least a portion of the bottom electrode, and a top electrode disposed above at least a portion of the piezoelectric layer, a wiring portion connected to the resonance portion such that the top electrode or the bottom electrode extends into the wiring portion, a connection electrode connecting the top electrode and the bottom electrode to an external device, and a heat transfer member connecting a portion of at least one of the bottom electrode and the top electrode that is disposed in the wiring portion to the substrate. The resonance portion is provided with a cavity disposed below the bottom electrode, and the heat transfer member is disposed outside of the cavity.

Bulk acoustic wave filter device

A surface acoustic wave (SAW) filter device includes: a first layer disposed on a substrate; an inter-digital transducer (IDT) electrode layer disposed on the first layer; a second layer covering the IDT electrode layer and the first layer; and an overlay layer covering the second layer, wherein the first layer includes any one or any combination of any two or more of a metal layer, a metal oxide layer, and an oxide layer.

Saw filter device and method of manufacturing the same

A touch sensor includes a transparent substrate, and an electrode pattern formed on the transparent substrate. The electrode pattern is formed by stacking at least two or more electrode layers, thereby enhancing the anti-corrosion and visibility of electrode patterns and ensuring the adhesive reliability of the transparent substrate and the electrode patterns.

Touch sensor

There is provided a touch sensor including: a base substrate; a first electrode pattern formed on the base substrate and including first electrode lines repeatedly arranged in parallel with each other; and a second electrode pattern formed on a surface spaced apart from a surface on which the first electrode pattern is formed and including second electrode lines intersecting with the first electrode lines and repeatedly arranged in parallel with each other, wherein an extension line connecting intersection points between the first and second electrode lines to each other is formed as an oblique line with respect to a horizontal direction.

A touch panel may include a substrate; a printing part formed on a bezel area of the substrate; and a plurality of electrodes provided on the substrate and the printing part and including conductive wires configuring a plurality of unit cells having a mesh shape. Portions of wires configuring each of the plurality of unit cells overlapped with a boundary line between the substrate and the printing part among the plurality of unit cells are disconnected.

Touch panel

Disclosed herein are a touch panel and a fabricating method thereof. In the touch panel according to an embodiment of the present invention, a noise shielding layer may be separately formed between a transparent substrate and an electrode pattern, thereby shielding noise that occur from a display coupled to the touch panel. In addition, through a bridge electrode pattern formed by patterning the noise shielding layer and a bridge insulating pattern patterned on an insulating layer formed on the noise shielding layer, a first electrode pattern and a second electrode pattern may be formed on the same plane of the transparent substrate so as to intersect with each other, thereby ensuring reliability of electrical connection between each electrode pattern.

Touch panel and fabricating method thereof

A touch panel may include: a substrate having an upper surface and a lower surface; a first electrode layer disposed on the lower surface of the substrate and formed in a mesh shape; a first insulating layer disposed on the lower surface of the substrate and disposed to surround the first electrode layer; a surface reforming layer disposed on a lower surface of the first insulating layer and capable of reforming a hydrophobic surface to a hydrophilic surface; and a second electrode layer disposed on a lower surface of the surface reforming layer and formed in a mesh shape.

Disclosed herein is a touch panel, including: a window substrate divided into an active area and a non-active area surrounding the active area; an electrode part having an electrode bezel pattern formed of a bezel ink in the active area of the window substrate and an electrode pattern integrally formed on one surface of the electrode bezel pattern; and a bezel part formed of the bezel ink in the non-active area of the window substrate, to surround the electrode part.

Touch panel and method for manufacturing the same

The touch sensor according to a preferred embodiment of the present invention includes: a transparent substrate; and an electrode formed on the transparent substrate in a mesh pattern, wherein the electrode has a line width of one side smaller than that of the other side in a thickness direction.

There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).

Chip resistor and method of manufacturing the same

There are provided a piezoelectric resonator and an electrode structure thereof. The piezoelectric resonator includes: a piezoelectric body oscillated according to an electrical signal; and first and second electrodes each including first and second electrode layers stacked on respective both surfaces of the piezoelectric body, wherein the first electrode layer includes one or more selected from the group consisting of chromium (Cr), nickel (Ni), titanium (Ti), and an alloy including any one thereof, the ratio of the thickness of the first electrode layer to the thickness of the first or second electrode is 3% to 30%; and the second electrode layer includes copper (Cu) or an alloy including copper (Cu), and the ratio of the thickness of the second electrode layer to the thickness of the first or second electrode is 70% to 97%.

Piezoelectric resonator and electrode structure thereof

The present invention provides an array type chip resistor including: a substrate having a plurality of grooves formed on both sides thereof at equal spaces; lower electrodes formed on both sides of a bottom surface of the substrate; upper electrodes formed on both sides of a top surface of the substrate; side electrodes electrically connected to the upper and lower electrodes; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes. The array type chip resistor can prevent the resistive element from being damaged due to external impact when mounted since the resistive element is printed inside of the lower electrodes of the bottom surface of the substrate.

Growing community of inventors

Suwon-si, South Korea

Jang Ho Park