Corning Incorporated

Janette Dawn Hevner

Yuhui Jin

Aize Li

John Robert Saltzer, Jr

A method of modifying a substrate comprising an etching step comprising contacting one or more primary surfaces of a glass, glass-ceramic, or ceramic substrate with a solution for a time period of 20 minutes to 8 hours to generate one or more etched primary surfaces, the solution comprising over 10 percent by weight of one or more alkali hydroxides, the solution having a temperature within the range of 100&#xb0; C. to 150&#xb0; C., the substrate having a thickness between the primary surfaces that decreases during the time period by 5 &#x3bc;m to 100 &#x3bc;m at a rate of 2 &#x3bc;m per hour or greater. The solution of the etching step does not comprise hydrogen fluoride. The one or more alkali hydroxides of the solution of the etching step can be sodium hydroxide (NaOH), potassium hydroxide (KOH), or a combination of both sodium hydroxide and potassium hydroxide.

Methods of reducing the thickness of textured glass, glass-ceramic, and ceramic articles with high concentration alkali hydroxide at elevated temperature

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Addison, NY, United States of America

Janette Dawn Hevner