Maxwell Technologies, Inc.

Space Electronics, Inc.

Data Device Corporation

Janet Patterson

Neil Eggleston

David R Czjakowski

David R Czajkowski

Larry L Longden

A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.

Apparatus for shielding integrated circuit devices

A radiation shielding integrated circuit device comprising a x-ray shielding layer for shielding an electronic circuit device from receiving an amount of x-rays greater than the total dose tolerance of the electronic circuit device; a base coupled to the x-ray shielding layer; a radiation shielding top coupled to the base; a radiation shielding bottom coupled to the base; and the electronic circuit device coupled to the x-ray shielding layer; wherein the electronic circuit device is shielded from receiving an amount of radiation greater than a total dose tolerance of the electronic circuit device.

Method and apparatus for shielding an integrated circuit from radiation

A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose tolerance of the circuit die. An integrated circuit device for use in high reliability applications. The integrated circuit device is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.

Method for shielding integrated circuit devices

The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

Radiation shielding of three dimensional multi-chip modules

A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

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San Diego, CA, United States of America

Janet Patterson