Agilent Technologies, Inc.

Jane Mei-Jech Lin

Shawming Ma

Jeremy Alfred Theil

Min Cao

Gary William Ray

Xin Sun

An array of active pixel sensors includes a substrate. An interconnect structure is formed adjacent to the substrate. The interconnect structure includes a plurality of conductive vias. A plurality of photo sensors are formed adjacent to the interconnect structure. Each photo sensor includes a pixel electrode. Each pixel electrode is electrically connected to the substrate through a corresponding conductive yet. A I-layer is formed over each of the pixel electrodes. The array of active pixel sensors further includes a conductive mesh formed adjacent to the photo sensors. An inner surface of the conductive mesh is electrically and physically connected to the photo sensors, and electrically connected to the substrate through a conductive via. The conductive mesh providing light shielding between photo sensors thereby reducing cross-talk between the photo sensors. The conductive mesh includes apertures that align with at least one of the pixel electrodes of the photo sensors.

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San Jose, CA, United States of America

Jane Mei-Jech Lin