Norton Company

Rogers Corporation

Saint-gobain Abrasives Technology Company

Jane L Cercena

Elinor B Keil

Karen M Conley

Nicolas Avril

David G Lund

Bethany L Salek

Gwo Shin Swei

Anthony C Gaeta

William P Harper

Richard T Traskos

Carlos L Barton

Richard H Vogel

Samuel Gazit

John A Olenick

Lynn E Burdick

Thomas S Kneeland

W David Smith

Daniel J Navarro

Mark F Sylvester

Angela M Kneeland

Scott E Derosier

Curtis H Kempton

Robert B Huntington

James S Rivers

Jeffrey B Ott

Richard Sargood

Howard R Wright

Wen L Yang

Kathleen R Olenick

Methods for orienting fibers and an apparatus for orienting fibers are provided for the fabrication of improved thin abrasive wheels utilizing uniform non-woven fiber reinforcement discs. The wheels are more resistant to hub push-out failure during grinding than wheels reinforced with woven fiber cloth.

Method and apparatus for fabricating abrasive tools

Method for fabricating abrasive tools

Method for fabricating abrasive discs

A coated abrasive backing material is provided which is suitable for heavy duty grinding applications is provided by a continuous solid resin matrix having dispersed therein an essentially isotropic fibrous web. The invention also provides a coated abrasive based on said backing.

Curl-resistant coated abrasives

A coated abrasives having very desirable efficiencies in production is provided by the use of a binder coat which comprises a compound having at least one function that is radiation curable and at least one function that is polymerizable under thermally activated conditions.

Dual-cure binder system

In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as 'x' and 'y' lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management. The manufacturing process of the present invention makes it possible to start or stop any via in any layer of the device.

Method of manufacture multichip module substrate

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Ashford, CT, United States of America

Jane L Cercena