Infineon Technologies Ag

Siemens Aktiengesellschaft

J&uuml;rgen Winterer

Bernd Stadler

Thies Janczek

Achim Neu

Eric Bootz

Gottfried Beer

Bernd Barchmann

Martin Petz

Xaver Schl&ouml;gel

Stefan Schmausser

Walter Juri

Otto Voggenreiter

Siegfried Fischer

Otto Gruber

J&uuml;rgen Steinbichler

A handling and mounting protection device is described that has a cap-shaped configuration with a covering layer which covers a contact-sensitive upper side of a component which is to be protected. Extending from the covering layer are locking arms with locking hooks which, in the state in which they are fitted onto the component, engage behind undercuts in the component in such a way that even after the component has been mounted they can still be released from it.

Handling and mounting protection device

The invention relates to a pressure sensor component comprising a base body and a pressure connection element. The base body comprises a chip carrier, onto which a semiconductor chip with an integrated pressure sensor is mounted. Contact is made with the semiconductor chip by means of connection, which are routed laterally out from the base body. The base body is open on one side, and the opening is bounded by side parts of the chip carrier. The pressure connection element is placed onto the upper end regions of the side parts. The invention is distinguished by the fact that the filler, with which the inner space of the base body is filled and the semiconductor chip is covered, is simultaneously used to connect and seal the pressure connection element and the base body. The ends of the pressure connection element are preferably configured in such a way that the filler is drawn by capillary forces into the interspace between side parts and pressure connection element. The pressure connection element is particularly preferably configured in such a way that hoses of different diameter can be attached.

Pressure sensor component with hose connection

The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire assembly except for protruding electrode terminals. Bond wires connect the electrode terminals with the pressure sensor and/or the electronic circuit of the semiconductor chip. The device encapsulation consists entirely of a homogeneous pressure-transmitting medium comprising an enveloping compound, which transmits the pressure to be measured as free from delay and attenuation as possible but is mechanically resistant and dimensionally stable. The pressure to be measured is transmitted directly by the enveloping compound onto the pressure-detecting surface of the semiconductor chip, and the pressure sensor and/or the pressure sensor component is covered tightly on all sides against mechanical and/or chemical influences.

Pressure sensor component

A semiconductor component is fashioned of a chip carrier comprising an approximately planar chip carrier surface on which chip carrier surface a semiconductor chip with a pressure sensor is secured, and composed of electrode terminals penetrating the chip carrier and electrically connected to the semiconductor chip, with a surface-mounted arrangement. The chip overlapping the chip carrier.

Semiconductor device

A bearer strip having components arranged in several parallel rows with variable spacing between the rows so as to increase packing density while providing sufficient empty space for introducing free flowing plastic on the bearer strip.

Arrangement of electronic components on a bearer strip

The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be measured. The component is encapsulated with electrically insulating material that encloses the semiconductor chip and/or the chip carrier at least in regions. A chimney-shaped connection piece that projects up relative to the pressure-detecting area of the pressure sensor penetrates through the encapsulation and is connected to the pressure sensor. The connection piece, which is a separate structural element is incorporated in the component encapsulation and it encloses at least the pressure-detecting surface area in a pressure-tight manner with its end bearing on the semiconductor chip. The connection piece is open toward the outside at its opposite end so as to expose the pressure sensor to the pressure to be measured. The invention furthermore relates to a method for producing such a pressure sensor component.

Growing community of inventors

Nürnberg, Germany

Jürgen Winterer

Growing community of inventors

Nürnberg, Germany

J&uuml;rgen Winterer

Jürgen Winterer