Ems-chemie Ag

J&uuml;rgen Spindler

Eberhard Kinkelin

Gerhard Poessnecker

Simon Sutter

Gerhard P&ouml;ssenecker

Thomas Weller

Gunther Sch&auml;ch

Low-melting copolyamide and their use as hot-melt adhesives

Novel, quick-crystallizing hot-melt adhesive masses having a melting point between 60&deg; and 100&deg; C. comprise a statistically-proportioned copolyester or copolyetherester based on terephthalic acid, adipic acid and a mixture of aliphatic diols; the molar proportion of terephthalic acid is between 55 and 85 mole %, relative to the total acid quantity; and the molar proportion of adipic acid is between 15 and 40 mole %. A combination of butane diol and hexane diol is used as the diol component; the molar component of butane diol is between 40 and 55 mole %; and the molar proportion of hexane diol is between 40 and 60 mole %. Up to 15 mole % of a dimer acid having a molar mass between 400 and 800 g/mole, or up to 10 mole % of a higher-molecular polyethylene glycol having a molecular mass of 600 to 4000 g/mole, can be used to increase the flexibility. The copolyester or copolyetherester hot-melt adhesive masses of the invention can be used in the hot-melt method, and in powder-form coating methods.

Low-melting copolyester and copolyetherester hot-melt adhesives

In a core-shroud bicomponent fiber, which exhibits a core and a shroud at least partially enveloping the core, an elevated abrasion behavior, a low compaction under exposure to temperature and pressure and a high strength of the fibers is achieved by having the shroud consist of 45-98% w/w of a first polyamide having a melting point exceeding 280&deg; C., and 2-20% w/w of a layer silicate.

Sheath-core bicomponent fiber and its applications

Growing community of inventors

Domat/Ems, Switzerland

Jürgen Spindler

Growing community of inventors

Domat/Ems, Switzerland

J&uuml;rgen Spindler

Jürgen Spindler