Technische Universitat Munchen

Pri Automation, Inc.

J&uuml;rgen H&ouml;ppner

Josef Zimmermann

Josef Zimmerman

Johannes Schlip

A mechanism for the contactless gripping and positioning of a component having a planar peripheral edge region, including a sound producing device producing a pattern of levitation sound waves for keeping the component in suspension at a selected position. The sound producing device is configured wherein only the peripheral edge region of the component lies in the sound wave pattern to be acted upon thereby and is fixed in the sound wave pattern by Bernoulli forces. The total surface area of the sound producing device is less than the component's total surface area facing the sound producing device.

Device for contactlessly gripping and positioning components

A handler for transporting planar substrates, in particular wafers, used in the semiconductor industry, between at least two stations. The handler includes a movable flat support arm for receiving a substrate and means for defining the location of the substrate in the area of a predetermined point on the support arm. A vibration generator for generating a longitudinal ultrasonic vibration is provided, that the vibration generator interacts with the support arm in such a way that a substantially stationary vibration with at least one antinode can be set on the flat support arm, which permits a levitation of a substrate placed thereon. A means for defining the location of the substrate provide a lateral positioning exclusively by an interaction with the edge area of a substrate.

Growing community of inventors

Fahrenzhausen, Germany

Jürgen Höppner

Growing community of inventors

Fahrenzhausen, Germany

J&uuml;rgen H&ouml;ppner

Jürgen Höppner