Infineon Technologies Ag

J&ouml;rg Berthold

Marc Tiebout

Dieter Sewald

The coil and coil system is provided for integration in a microelecronic circuit. The coil is placed inside an oxide layer of a chip, and the oxide layer is placed on the substrate surface of a substrate. The coil comprises one or more windings, whereby the winding(s) is/are formed by at least segments of two conductor tracks, which are each provided in spatially spaced-apart metalization levels, and by via-contacts which connect these conductor track(s) and/or conductor track segments. In order to be able to produce high-quality coils, a coil is produced with the largest possible coil cross-section, whereby a standard metalization, especially a standard metalization using copper, can, however, be used for producing the oil. To this end, the via contacts are formed from a stack of two ore more via elements arranged one above the other. Parts of the metalization levels can be located between the via elements.

Growing community of inventors

München, Germany

Jörg Berthold

Growing community of inventors

München, Germany

J&ouml;rg Berthold

Jörg Berthold