General Electric Company

Jana M Whalen

Herbert S Chao

Robert Edgar Colborn

Michael John Davis

James E Tracy

James R Presley

Edward F Chu

John E Hallgren

Victoria J Eddy

Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.

Curable dielectric polyphenylene ether-polyepoxide compositions

Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.

Curable polyphenylene ether-polyepoxide compositions from melt processed

Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may be used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.

Blends of high molecular weight polyphenylene ethers with various epoxy materials, particularly polyglycidyl ethers of bisphenolic compounds, are homogeneous at high temperatures and may be cured in the presence of a catalyst such as aluminum tris(acetylacetonate) or zinc bis(acetylacetonate), especially in the additional presence of an accelerator such as a basic nitrogen compound. The cured compositions have advantageous physical and electrical properties and are useful, for example, for the preparation of printed circuit boards.

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Clifton Park, NY, United States of America

Jana M Whalen