Universiteit Gent

Imec

Imec Vzw

Katholieke Universiteit Leuven

Interuniversitair Microelektronica Centrum (imec)

Universiteit Antwerpen

Interuniversitair Micro-elektronica Centrum Vzw

Univesiteit Gent

Carpenter Engineered Foams Belgium

Katholieke Universiteit Leuven, Ku Leuven R&d

Jan Vanfleteren

Fabrice Axisa

Frederick Bossuyt

Dominique Brosteaux

Eric Beyne

Hugo De Winter

Thomas Vervust

Paresh Limaye

Rik Verplancke

Wouter Van Putte

Jean-Pierre Timmermans

Bart Plovie

Sofie Moorkens

Matthias Willockx

Herbert De Pauw

Patricia Khashayar

Sergei Stoukach

Bjorn Vandecasteele

Wim Christiaens

Pritesh Dagur

Behnam Madadnia

The present invention provides a compressible electrode comprising a stably deformable polymer layer comprising a first outer surface, a second outer surface and at least one deformed portion formed as at least one indentation in the first outer surface and at least one corresponding protrusion in the second outer surface, and at least one non-deformed portion. The electrode further comprises at least one stretchable conductor layer arranged on or within the stably deformable polymer layer at the deformed portion and/or at the non-deformed portion. Further, the stably deformable polymer layer is stably deformed at the at least one deformed portion. The electrode further comprises an elastic material arranged on the first outer surface such that the elastic material fills the at least one indentation.

Compressible electrode

The present invention relates to a method for integrating an electronic circuit in or on a medical stent. The method comprises obtaining () a deformable medical stent () in a substantially planar shape, in which the deformable medical stent is adapted for being deployed in a substantially cylindrical shape in the body. The method also comprises attaching () a deformable electronic circuit () onto the deformable medical stent in the planar shape thereby forming a deformable hybrid structure. The method also comprises shaping () said hybrid structure into the cylindrical shape.

Method for integrating an electronic circuit in or on a stent

An electron microscopy grid, includes: (i) a perforated substrate, (ii) a support film on the perforated substrate, the support film having a thickness of 60 Å or less, and (iii) linkers attached on top of the support film. The linkers has at least one affinity group for immobilizing an analyte; wherein the linkers form a non-random pattern on the support film.

Electron microscopy grid

A method for deriving a calibration curve for determining a concentration of an analyte in an electrochemical reactor comprises determining a current level between a functionalized electrode and a reference electrode in the electrochemical reactor in absence of an analyte, the current level forming a zero-concentration current; injecting a fluid comprising an analyte in a first given concentration in the electrochemical reactor, determining after the predetermined amount of time a first calibration current level corresponding to the first given concentration and calculating a first current ratio of the first current level to the zero-concentration current; repeating the previous step for at least a second given concentration of the analyte, yielding at least a second current ratio of a second current level to the zero-concentration current; obtaining a calibration curve indicative of current ratio as a function of concentration from the first current ratio and at least the second current ratio.

Method and system for determining biomarker concentration

Methods are provided for manufacturing flat devices to be used for forming a shape-retaining non-flat device by deformation of the flat device. Based on the layout of a non-flat device, a layout of a flat device is designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.

Method of manufacturing a flat device

A stretchable electronic device is disclosed. In one aspect, the device includes at least one combination of a stretchable electronic structure having a first Young's modulus and a rigid or flexible electronic structure having a second Young's modulus higher than the first Young's modulus. The stretchable electronic structure and the rigid or flexible electronic structure may be electrically connected to each other by a semi-transition structure having a third Young's modulus with a value in a range between the first and the second Young's modulus.

Stretchable electronic device

A stretchable electronic device is disclosed. In one aspect, the device has a stretchable interconnection electrically connecting two electronic components. The stretchable interconnection includes an electrically conductive channel having a predetermined first geometry by which the channel is stretchable up to a given elastic limit and a first flexible supporting layer provided for supporting the electrically conductive channel and having a predetermined second geometry by which the first supporting layer is stretchable. The predetermined second geometry has a predetermined deviation from the predetermined first geometry chosen for restricting stretchability of the electrically conductive channel below its elastic limit.

A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.

Semiconductor package

A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers.

Composite substrate

A method for manufacturing a stretchable electronic device is disclosed. In one aspect, the device comprises at least one electrically conductive channel connecting at least two components of the device. The method comprises forming the channel by laser-cutting a flexible substrate into a predetermined geometric shape.

Method for manufacturing a stretchable electronic device

A method is provided for fabricating a porous elastomer, the method comprising the steps of: providing a predetermined amount of a liquid elastomer and a predetermined amount of a porogen; mixing the liquid elastomer and the porogen in vacuum until a homogenous emulsion without phase separation is formed; curing the homogenous emulsion until polymerizations of the emulsion is reached, thereby forming a cured emulsion; and removing the porogen from the cured emulsion. The method can advantageously be used for forming biocompatible porous elastomers and biocompatible porous membranes.

Method of fabricating a porous elastomer

A method of manufacturing a semiconductor device is provided, involving forming a first flexible film on a rigid carrier substrate, attaching a die to the flexible film, so as to leave contacts on the die exposed, forming a wiring layer to contact the contacts of the die, and releasing the flexible film where the die is attached, from the carrier. An area of the first flexible film where the die is attached can have a lower adhesion to the rigid carrier substrate than other areas, so that releasing can involve cutting the first flexible film to release a part of the area of lower adhesion, and leaving an area of higher adhesion. A combined thickness of the die, the first flexible film and the wiring layer can be less than 150 &#x3bc;m, so that the device is bendable. Devices can be stacked.

Method for embedding dies

Methods of producing a composite substrate and devices made by the methods are disclosed. One of the methods comprises providing a flexible sacrificial layer, producing one or more patterned conducting layers on the flexible sacrificial layer, bending the sacrificial layer into a predetermined shape, providing a stretchable and/or flexible material on top of and in between features of the one or more patterned layers.

Methods of producing a composite substrate

The present invention is related to a flip-chip-on-board (FCOB) assembly technology applicable for mounting large chips with high I/O count or small pitch, mounted on low-cost or low-grade substrates. The assembly technology uses both an isotropically conductive adhesive (ICA) and a non-conductive material (NCA) in the same assembly cycle. The thermocompression step establishes at the same time the electrical and mechanical interconnections and the curing of the adhesives.

Growing community of inventors

Gentbrugge, Belgium

Jan Vanfleteren