Lpkf Laser & Electronics Ag

Lpkf Laser & Electronics Se

Jan Van Aalst

Malte Schulz-Ruhtenberg

Manuel Sieben

Robin Krüger

Bostjan Podobnik

Moritz Woller

Drago Kovacic

Robin A Krüger

Andreas Bönke

A method of production of glass reaction vessels includes irradiating a laser beam of a wavelength for which a first glass plate is transparent onto the surface of the first glass plate. The first hiss plate is etched. Etching of the first glass plate is terminated when the recesses extend, over only a portion of the thickness of the first glass plate and therefore the recesses have a bottom formed in the first glass plate as a single piece.

Single-piece reaction vessel made of glass, production method, and analysis method

A device for depositing liquid droplets onto a carrier includes a droplet generator and a holding device for the carrier, and a detector arranged to detect a signal for each liquid section or droplet, and a transport device for moving the holding device relative to the droplet generator and preferably a memory connected to the detector.

Device and method for depositing liquid on carriers

A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

Method for partially stripping a defined area of a conductive layer

A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.

Growing community of inventors

Barsinghausen, Germany

Jan Van Aalst