Atotech Deutschland Gmbh

Jan Sperling

Dirk Rohde

Mauro Castellani

Grigory Vazhenin

Andreas Kirbs

Stefan Pieper

Heiko Brunner

Josef Gaida

Sven Lamprecht

Kai-Jens Matejat

Stefanie Ackermann

Christian Ohde

Catherine Schoenenberger

An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising 

Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

A method of forming a solderable solder deposit on a contact pad, comprising the steps of providing an organic, non-conductive substrate which exposes said contact pad under an opening of a first non-conductive resist layer, depositing a conductive layer inside and outside the opening such that an activated surface results, thereby forming an activated opening, electrolytically depositing nickel or nickel alloy into the activated opening such that nickel/nickel alloy is deposited onto the activated surface, electrolytically depositing tin or tin alloy onto the nickel/nickel alloy, with the proviso that the electrolytic deposition of later steps results in an entirely filled activated opening, wherein the entirely filled activated opening is completely filled with said nickel/nickel alloy, or in the entirely filled activated opening the total volume of nickel/nickel alloy is higher than the total volume of tin and tin alloy, based on the total volume of the entirely filled activated opening.

Method of forming a solderable solder deposit on a contact pad

An aqueous indium or indium alloy plating bath comprising  

Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy

The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps

Process for indium or indium alloy deposition and article

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Berlin, Germany

Jan Sperling