Finisar Corporation

Technische Universiteit Delft

2m Engineering Limited

2m Engineering Lmt.

Kiwa Water Research B.v.

Jan Mink

Marcel Franz Christian Schemmann

Remigius Subertus Maria Van Roemburg

Jacob Caro

Abraham Van Der Gaag

A force sensor includes a first surface and a second surface located opposite the first surface, the first surface translatable against a resilient force in a direction towards and/or from the second surface; a distance sensor, arranged to measure the distance between the first surface and the second surface; characterized in that the force sensor comprises a flexible coupling extending along the direction, flexibly coupling the first surface to the second surface; and in that the flexible coupling is provided with a resilient means to provide the resilient force; and a space encompassed by the flexible coupling together with the first surface and the second surface being accessible to the distance sensor, the space filled with a medium for providing the resilient force.

Force sensor and corresponding force monitoring mattress

A sensor for identifying at least one particle by means of Raman-spectroscopy, comprising an optical trapping system for the at least one particle, including a laser-beam source, acting further as a Raman excitation source for the at least one particle, and a Raman-spectrometer for measuring the spectrally modified light scattered by the at least one particle and for identifying same, wherein the optical trapping system comprises a photonic crystal directly linked with the laser-beam source, which photonic crystal has multiple cavities at predetermined positions, and wherein the laser-beam source in use resonantly excites one or more predetermined electromagnetic modes of the cavities at said positions for trapping and Raman-exciting the at least one particle.

Sensor for identifying at least one particle by means of raman-spectroscopy

Method and system for an optical package are disclosed. In one embodiment of the present invention, an optical package comprises: a lead frame; a substrate mounted inside the lead frame; one or more leads attached to the substrate; an optical device or component such as a LOA chip mounted on top of the substrate; a window cap hermetically sealing the optical device or component; one or more lens attached to either side of the window cap; two fibers attached on either side of the window cap; two holes or vias that may serve as inputs into the window cap or outputs from the window cap; an electrical out extending from the window cap; and an electrically isolated enclosure enveloping all contents inside the lead frame.

Method and system for optical packaging

Growing community of inventors

Geldrop, Netherlands

Jan Mink