Osram Opto Semiconductors Gmbh

Osram Gmbh

Osram Oled Gmbh

Osram Gesellschaft MIT Beschraenkter Haftung

Osram Gesellschaft MIT Beschrankter Haftung

Jan Marfeld

Ralph Wirth

Walter Wegleiter

Karl Weidner

Bernd Barchmann

Axel Kaltenbacher

Oliver Wutz

Ales Markytan

Moritz Engl

Christian Gärtner

Stefan Grötsch

Jörg Erich Sorg

Ralph Bertram

Michael Bestele

Steffen Köhler

Simon Jerebic

Sven Gerhard

Tony Albrecht

Markus Pindl

Julius Muschaweck

Alexander Linkov

Alessandro Scordino

Ulrich Streppel

Stephan Kaiser

Andreas Löffler

Simon Schwalenberg

Roland Enzmann

Roland Schulz

Soenke Tautz

Erik Heinemann

Christian Gaertner

André Somers

Albert Schneider

Markus Kirsch

Horst Varga

Jan Seidenfaden

Hubert Schmid

Manfred Scheubeck

Julius Muschawek

Janick Ihringer

Allesandro Scordino

Stefan GRÖTSCH

Steffen KÖHLER

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.

Optoelectronic semiconductor component

In an embodiment, the semiconductor laser () comprises a semiconductor layer sequence () in which an active zone () for generating laser radiation (L) is located. Several electrical contact surfaces () serve for external electrical contacting of the semiconductor layer sequence (). Several parallel ridge waveguides () are formed from the semiconductor layer sequence () and configured to guide the laser radiation (L) along a resonator axis, so that there is a separating trench () between adjacent ridge waveguides. At least one electrical feed () serves from at least one of the electrical contact surfaces () to guide the current to at least one of the ridge waveguides (). A distance (A) between the ridge waveguides is at most 50 μm. The ridge waveguides () are electrically controllable individually or in groups independently of one another and/or configured for single-mode operation.

Semiconductor laser and projector

A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.

A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.

A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.

Laser component

An optical element is provided for beam shaping for radiation emitted by a radiation-emitting semiconductor chip. The optical element includes a radiation entrance face and a boundary surface different from the radiation entrance face with a first region and a second region. The first and second regions are arranged and embodied such that a first radiation portion of radiation entering the optical element through the radiation entrance face is reflected in the first region and after reflection in the first region is deflected in the second region towards a plane defined by the radiation entrance face.

Optical element and lighting device comprising an optical element

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.

A lighting device includes a light source including at least two light-emitting diode chips which emit light of mutually differing colors when in operation, and an optical element in the form of a solid body made from a dielectric material including a radiation entrance face facing towards the light-emitting diode chips, a radiation exit face remote from the light-emitting diode chips, and a circumferential face connecting the radiation entrance face and the radiation exit face to one another, wherein the circumferential face is reflective to the light emitted by the light-emitting diode chips when in operation, and the radiation entrance face and/or the radiation exit face is/are non-planar at least in places, wherein a gap, which is filled with a gas, is arranged between at least one of the light-emitting diode chips of the light source and the radiation entrance face, and the optical element is a sole optical element of the lighting device, which optical element is arranged downstream of all light-emitting diode chips of the light source.

Lighting device with optical element in the form of a solid body

A lighting module for emitting mixed light comprises at least one first semiconductor element which emits unconverted red light, at least one second semiconductor element which emits converted greenish white light having a first conversion percentage, at least one third semiconductor element which emits greenish white light having a second conversion percentage that is smaller than the first conversion percentage, and at least one resistor element having a temperature-dependent electric resistance, the second semiconductor element being connected in parallel to the third semiconductor element.

Lighting module for emitting mixed light

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via including an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via includes a contact pin, the contact pin including an electrically conductive material; and the contact pin is laterally completely enclosed by the shaped body.

An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.

Optoelectronic component device, method of producing an optoelectronic component device, and method of operating an optoelectronic component device, method of operating an optoelectronic device having improved emission characteristics

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.

An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.

Optoelectronic component and method for producing an optoelectronic component

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Wuppertal, Germany

Jan Marfeld