Siemens Aktiengesellschaft

Jan Kuypers

Wolfgang Pernegger

Laurent Danneels

Johan Helder

James Piolon

This invention relates to an electroplating device for partially plating a series of items moving along a path at a constant level, the device including at least one electroplating bath positioned along the path having end walls with slots therein through which the items to be plated may pass, and an end wall configuration adjacent the slot which combines with a circulation pump to maintain a constant liquid level in the bath above the bottom of the slot.

Electroplating device for partially plating items in transit

An electroplating device for partial plating of items in continuous transit through a plating bath. The bath includes an enclosure having slots for movement of the articles to be plated lengthwise of the bath. A cross flow of treatment liquid is maintained in the constant level bath through the provision of flow directing vanes, the flow being provided by a treatment liquid circulation pump.

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Brugge, Belgium

Jan Kuypers