Ams International Ag

Tusti B.v.

Technische Universiteit Eindhoven

Jan Kolijn

Aurelie Humbert

Dimitri Soccol

Rafael Sablong

Bjorn Tuerlings

Cornelis Bastiaansen

Dirk Gravesteijn

The invention relates to a non-corrosive process for cleaning a recyclable material comprising the following steps: (a) providing a contaminated recyclable material; (b) treating the contaminated recyclable material at a temperature in the range of from 45-30&#xb0; C. with a solution that contains one or more polyols to remove contaminants from the contaminated recyclable material, wherein the one or more polyols is (are) present in an amount of at least 15 wt. %, based on the total weight of the solution, thereby forming a liquid 10 mixture which comprises one or more polyols, contaminants removed from the recyclable material, and treated recyclable material; (c) separating at a temperature in the range 10-55&#xb0; C. at least part of the recyclable material as obtained in step (b) from the liquid mixture as obtained in step (b); (d) allowing at least part of the remaining liquid mixture as obtained in step (c) to phase-1 separate into a polyol phase and a phase which contains contaminants removed from the contaminated recyclable material; (e) recovering the polyol phase as obtained in step (d); (f) recovering the phase which contains contaminants removed from the recyclable material as obtained in step (d); and 20 (g) recovering the separated recyclable material as obtained in step (c).

Non-corrosive process for cleaning a recyclable material

Disclosed is an integrated circuit () comprising a semiconductor substrate () carrying a plurality of circuit elements (); and a carbon dioxide sensor () over said semiconductor substrate, said sensor comprising a pair of electrodes () laterally separated from each other; and a carbon dioxide (CO) permeable polymer matrix () at least partially covering the pair of electrodes, said matrix encapsulating a liquid () comprising an organic alcohol and an organic amidine or guanidine base. A composition for forming such a COsensor on the IC and a method of manufacturing such an IC are also disclosed.

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Eindhoven, Netherlands

Jan Kolijn