Omi International Corporation

Jan J Hendriks

John R Lovie

Gerardus A Somers

The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diamino oxalate, (Pd(NH.sub.3).sub.2 C.sub.2 O.sub.4), palladium tetraamino oxalate (Pd(NH.sub.3).sub.4 C.sub.2 O.sub.4) or an ammonium or alkali metal salt of palladium dioxalate (M.sub.2 Pd(C.sub.2 O.sub.4)).sub.2), where M represents an ammonium or alkali metal cation. Alloying metal ions may also be present, as may an electrolyte, a brightener and/or a stress reducer.

Palladium and palladium alloy plating

A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.

Growing community of inventors

Sint Oedenrode, Netherlands

Jan J Hendriks