Epcos Ag

Tdk Electronics Ag

Jan Ihle

Gerald Kloiber

Werner Kahr

Thomas Bernert

Anke Weidenfelder

Christl Lisa Mead

Thomas Stendel

Heinz Strallhofer

Oliver Bard

Bernhard Ostrick

Benjamin Bohl

Bernhard Steinberger

Sebastian Redolfi

Steffen Mehlig

Bert Hundertmark

Markus Puff

Wolfgang Grundmann

Christian Wohlgemuth

Lutz Kirsten

Volker Wischnat

Michael Krenn

Andreas Peschka

Danilo Neuber

Stephan Bigl

Stefan Endler

Karin Hajek

Sasa Sabeder-Daiminger

Torben Seifert

Gerhard Hojas

Jeffrey Krotosky

Marko Vrabelj

Helmut Poelzl

Markus Rath

Moritz V Witzleben

Thomas Haferkorn

Gerd Scheiwe

Verena Fischer

Bernd Polder

Helmut Pölzl

In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.

Sensor element and method for manufacturing a sensor element

In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

Sensor element and method for producing a sensor element

In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

Sensor arrangement and method for producing a sensor arrangement

In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.

Component and method for manufacturing a component

An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.

Method of fastening a contact element in an electrical component, and electrical component having a contact element

An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

NTC thin film thermistor and method for producing an NTC thin film thermistor

In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

In a method for fastening a contact element () in an electrical component (), a contact element () is arranged on a contact surface () of a base body () of the component () and a laser beam () is directed onto a region () of the contact element () in such a way that the base body () is not located in the beam direction () of the laser beam (). The contact element () is partially melted by the laser beam (), so that the molten material () wets the contact surface () and produces fastening of the contact element () on the contact surface ().

Method for fastening a contact element in an electrical component, and electrical component having a contact element

A sensor element, a sensor arrangement, and a method for manufacturing a sensor element and a sensor arrangement are disclosed. In an embodiment, a sensor element includes a ceramic main body having at least one electrode arranged at the main body and having at least one contact piece for the electrical contacting of the electrode, wherein the contact piece is fastened to the electrode by welding or bonding.

Sensor element, sensor arrangement, and method for manufacturing a sensor element and a sensor arrangement

A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.

Media-separated pressure transmitter

A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.

A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.

Sensor element, sensor arrangement, and method for manufacturing a sensor element

A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element for temperature measurement includes a ceramic carrier and at least one NTC layer printed on the carrier, wherein the NTC layer covers at least part of a surface of the carrier, and wherein the sensor element is designed for wireless contacting.

The invention relates to a temperature sensor system comprising a temperature probe element and a first ceramic housing part. The temperature probe element comprises a sensor element and electrical feed lines. The first ceramic housing part comprises a sleeve-shaped lower part with a closed lower end and an open upper end, and an upper part connected to the open upper end. The sensor element is arranged in the sleeve-shaped lower part. The upper part has recesses in which the electrical feed lines are partially arranged and guided. The lower part and the upper part form one piece. Also disclosed is a method for producing a temperature sensor system.

Temperature sensor system and method for producing a temperature sensor system

The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.

Growing community of inventors

Grambach, Austria

Jan Ihle