3M Innovative Properties Company

Jan Heimink

Suresh Iyer

Thomas Q Chastek

Zhong Chen

Kerstin Unverhau

Andreas Backes

Siegfried Rainer Goeb

Panu K Zoller

Adrian T Jung

Jan D Forster

Dirk Hasenberg

Doreen Eckhardt

Frank Kuester

Jan U Wieneke

Ruchi Pandey

Regina Sikora

Claudia Torre

Robert Dennis Waid

Siegfried Goeb

Jan Ulrich Wieneke

Ross John Devolder

Jeremy Del Unruh

Gregory Bernard Gadbois

Steven Dean Bray

Jan Wieneke

Jack Jefferson Williams

Shujun S J Wang

Peggy Sperl Willett

Jan Daniel Forster

Bettina Radek

The present disclosure relates to a pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer comprising a hollow non-porous particulate filler material, wherein the surface of the hollow non-porous particulate filler material is provided with a hydrophobic surface modification. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly.

Pressure sensitive adhesive assembly comprising filler material

The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive assembly comprises a polymeric foam layer comprising a polymeric base material and a particulate filler material comprising a thermoplastic material, and wherein the polymeric foam layer has a complex viscosity comprised between 2,000 Pa&#xb7;s to 80,000 Pa&#xb7;s, when measured at 120 C according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

Pressure sensitive adhesive assembly comprising thermoplastic filler material

The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa&#xb7;s to 80,000 Pa&#xb7;s, when measured at 120&#xb0; C. according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

Pressure sensitive adhesive assembly suitable for bonding to uneven substrates

The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa&#xb7;s to 80,000 Pa&#xb7;s, when measured at 120C according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

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Schwelm, Germany

Jan Heimink