U.S. Philips Corporation

Asml Netherlands B.v.

Other

Carl Zeiss Smt Gmbh

Carl-zeiss-smt Ag

Jan Haisma

Gijsbertus A Spierings

Cornelis L Adema

Lambertus Postma

Theodorus Martinus Michielsen

Hendrik J Joormann

Pieter Van Der Werf

Hendrik Verweij

Franciscus J Van Der Kruis

Peter W De Haas

Franciscus Petrus Widdershoven

Ulrich E Enz

Rudolf Brehm

Johannes M Pasmans

Cornelis L Alting

Klaas L Van Mierloo

Erik Roelof Loopstra

Johannes Catharinus Hubertus Mulkens

Christiaan Alexander Hoogendam

Bob Streefkerk

Johannes Jacobus Matheus Baselmans

Jacobus J Ruigrok

Gerardus H Somers

Evert M Kamerbeek

Dieter W Mateika

Paul Graupner

Bernard Gellrich

Udo K Biermann

Nicodemus Hattu

Josephus J Braat

Henricus G Maas

Gijsbertus Bouwhuis

Antonius G Verhulst

Jakob Vijfvinkel

Antonius J Nicia

Aart A Van Gorkum

Marnix G Collet

Albert Smid

Willem Frederik Druyvesteyn

Waltherus W Van Den Hoogenhof

Henricus A Van Hal

Joseph G Van Lierop

John A Slatter

Johannes W Van Der Velden

Poul K Larsen

Theo J Popma

Pieter K De Bokx

Johan G De Bruin

Johannes F Verhoeven

Johannes F d'Achard Van Enschut

Piet F Bongers

Andries R Miedema

Jan A Pals

Gijsbert Prast

Evert H Dekker

Jan C Gijsbers

Leonardus A Van Hoof

Johannes A Pistorius

Frans W Saris

Matthias Jj Theunissen

Edgard Alfred Hugues

Eltjo Scholtens

Johanna M Mulder

Petrus Heller

Erich Volkel

Henry E Brockman

Johannes E Van Den Meerakker

Johannes T Schrama

Horst Laudan

Dirk K De Boer

Johannes C Teunissen

Jan D Veldkamp

Jean-Marie Bacchus

Johannes K Boesten

Henderikus deVroome

Johannes F Van Der Veen

Tim De Jong

Willem A Douma

Jurren H Walters

Hendrikus J Nabben

Wilhelmus P Rutten

Paul H Joosten

John M Robertson, Deceased

Hendrik F Van Den Berg

By Freidrich De Haan, Administrator

Theodorus L Van Rooy

Albertus J Rombouts

Elizabeth M Alexander

Josephus H Van Vegchel

Martinus Verheijen

Arie J De Kock

Mathijs P Souts

The joint between the projection system element and its support comprises an inorganic layer or a direct bond and is thus liquid tight, which can prevent deformation by an immersion liquid. The joint can be made either warm or cold. Solders, glue, and glue protection can all be used in the formation of this joint. In an embodiment, the elements and its support are made of quartz.

Lithographic apparatus and device manufacturing method

An image processing system creates a 2-dimensional output image with enhanced depth sensation by operating on a 2-dimensional input image. The system processes the input image non-uniformly by selecting an area in the input image according to a predetermined criterion, and changing a property, e.g., its brightness, of the area relative to a corresponding property of a complement of the area in the input image.

Image processing system for handling depth information

A three-dimensional image display system, based on a novel depth concept referred to as Double-D-Depth, includes a first display device (3) and at least a second display device (4) which, viewed along the system axis (9-91), are offset with respect to each other and are each intended to partially display the same two-dimensional image of a scene, while parameters which are relevant to depth representation are included in the form of an additional dedicated intensity gradation in at least one of the displayed images, and all images, together with the axial distance (.quadrature.L) in between, evoke a depth effect with a viewer (10).

Three-dimensional image display system

A method of manufacturing an X-ray optical element. The element consists of a body of a material having a shape memory. At a high temperature, i.e. a temperature beyond the transition temperature of the material, the body is pressed so as to impart a first, desired shape. A surface of the body is thus shaped for example, as a logarithmic spiral or as another curved shape. After cooling to a low temperature, i.e. a temperature below the transition temperature of the material, a second, machinable shape is imparted to the body, preferably a flat surface. A number of precision operations can be performed on this second, machinable shape, for example polishing to a surface roughness of 0.5 nm RMS. Subsequent to this precision operation, the body is heated and resumes its first, desired shape which is retained after cooling. The body can be provided, if desired, with a comparatively thin surface layer which is also polished in the flat shape and which bends when the body resumes the desired shape. This layer can be chosen on the basis of desired mechanical (polishability) or X-ray optical properties. The X-ray optical element may comprise notably a multilayer mirror for X-ray purposes, thus forming a high- precision crystal for wavelength analysis.

Method of manufacturing an X-ray optical element for an X-ray analysis

A method is set forth of manufacturing a silicon body (5) having an n-type top layer (1') and an adjoining, more highly doped n-type base layer (2'), by which a first, n-type silicon slice (1) and a second, more highly doped n-type silicon slice (2) are put one on the other and then bonded together by heating. To obtain a low contact resistance between top layer (1') and base layer (2'), a boundary layer having a higher doping than the to player (1') is provided in the top layer (1') adjoining the base layer (2'). According to the invention, the boundary layer is formed by diffusion of an n-type dopant (11, 14) into the first slice (1) from the second slice (2) during heating. The concentration of the n-type dopant (11, 14) is taken to be so high in this case that boron (12) present as an impurity is overdoped, so that undesired pn transitions cannot occur. Measures according to the invention present the advantage that pollution of the first slice (1) is counteracted, while in addition the boundary layer is given a steep concentration profile. Semiconductor devices manufactured in body (5) will as a result have a comparatively high switching speed and a comparatively low forward bias.

Method of fabricating a semiconductor device having a top layer and base

Method of polishing a surface (5a) of a noble metal or an alloy comprising mainly noble metal, in which a polishing means is moved across the surface while exerting a polishing pressure for obtaining a plane and smooth polished surface without any defects. A composition comprising demineralized water with 20 to 40% by weight of an organic liquid comprising a poly-alcohol or a derivative thereof, for example, glycerol, and particles which can be encapsulated and have a Knoop's hardness of between 5 and 50 GPa, for example Al.sub.2 O.sub.3 grains, is used as a polishing means.

Method of polishing a surface of a noble metal

Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm.sup.2 for obtaining a plane and smooth polished surface without any defects. A composition of a polishing component comprising a colloidal suspension of SiO.sub.2 particles having an average particle size of between 20 and 50 nm in an alkali solution, demineralized water and a chemical activator is used as a polishing means.

Method of polishing a surface of copper or an alloy comprising mainly

A first object, which comprises organic material, is bonded to a second object by a method whereby both objects are provided with complementary optically smooth surfaces, subsequent to which these surfaces are brought into substantial contact with one another, consequent upon which spontaneous atomic bonds are formed between atoms of the two objects. The strength of the atomic bonds thus formed can be increased by subsequently heating the region of contact of the two surfaces.

Method of bonding two objects, at least one of which comprises organic

The method of intimately joining a hard magnetic part to a soft magnetic part in the manufacture of an electrical machine comprising polishing the joining surfaces such that the surface roughness hight is about less than or equal to two nanometers and joining the parts by direct bonding.

Electrical machine and method of manufacturing the electrical machine

Method of manufacturing a thin-film magnetic head in which a main layer (5) of a non-magnetic material is formed on a support, which layer is recessed by removing material from a side remote from the support, said recess being subsequently filled up with a soft-magnetic material for forming a flux guide (17a, 17b), whereafter the main layer provided with the filled recess is mechanochemically polished for forming a main surface (19) at which subsequently a layer of a magnetoresistive material is provided for forming a magnetoresistive element (23).

Method of manufacturing a thin-film magnetic head

Method of manufacturing a magnetoresistive magnetic head in which a first insulation layer (5) of a non-magnetic material is formed on a support face (3a), on which insulation layer a soft-magnetic layer having an upper face remote from the first insulation layer is formed by deposition of a soft-magnetic material. Subsequently a layer portion is removed for forming the flux-guiding elements (17a, 17b) and an aperture extending between said elements, and non-magnetic material for forming a second insulation layer (18) having an upper face remote from the soft-magnetic layer is deposited on the soft-magnetic layer and in the aperture formed therein, which second insulation layer has such a thickness that, viewed in a direction transverse to the support face, the smallest distance between the support face and the upper face of the second insulation layer is larger than the largest distance between the support face and the upper face of the soft-magnetic layer. Subsequently, a mechanochemical polishing treatment is performed as from the upper face of the second insulation layer for forming a main surface (19) at which magnetoresistive material is subsequently deposited for forming a magnetoresistive element (23).

An electrical machine comprises a stationary first section (1) and a second section (5) which is movable relative to the stationary section. At least one of the sections comprises a soft-magnetic part (7) and a hard-magnetic part (9). A surface (7a) of the soft-magnetic part and a surface (9a) of the hard-magnetic part are fixed intimately to one another by direct bonding.

Electrical machine with directly bonded magnetic parts

Methods and device for manufacturing a plate with a plane main surface or with parallel main surfaces, whereby material is taken off from the edges of the plate and from the central portion of the plate alternately by means of polishing in order to obtain main surfaces having a convex, plane, or concave shape. Polishing is stopped after at least one transition from convex to concave or vice versa at the moment at which the main surface has a substantially plane shape or has substantially parallel main surfaces.

Method of manufacturing a plate having a plane main surface, method of

A description is given of a method and a device (1) for providing (replicating) a patterned resyntetic resin relief (37) on the surface (25) of a glass substrate (27). For this purpose, a UV-curable acrylate lacquer (33) is applied to the surface (25), after which a transparent mould (3) having a relief (13) is rolled-off over the surface (25). By means of a UV light source (17) and an elliptic mirror (21), the lacquer is cured at the location of the focal line (23), thereby forming said relief (37). The relief (13) of the mould (3) is replicated on the glass substrate (27). The method described enables a relief of small dimensions (10.times.10 .mu.m) to be seamlessly provided on a large fiat surface (1.times.1 m), without being hindered by large release forces.

Method of providing a patterned relief of cured photoresist on a flat

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Eindhoven, Netherlands

Jan Haisma