Tesa Se

Jan Ellinger

Klaus Keite-Telgenbüscher

Judith Grünauer

Thorsten Krawinkel

Alexander Steen

Anika Petersen

Thortsten Krawinkel

Klaus Keite-Telgenbüsher

Marc Husemann

Stephan Zöllner

Thilo Dollase

Michael Siebert

Matthias Koop

Minyoung Bai

Anja Staiger

Philipp Preuβ

Monika Junghans

Lesmona Scherf

Kerstin Metzler

Niko Lübbert

Klaus Telgenbüscher

Philipp Preuß

The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

Adhesive tape containing getter material

The invention relates to an adhesive tape comprising at least one layer of a pressure-sensitive acrylate adhesive comprising a polymer component and at least one additive, where the polymer component is composed of one or more copolymers each based on the following monomers: a) from 5 to 35% by weight of one or more monomers containing hydroxy groups and having a copolymerizable double bond; b) from 0 to 50% by weight of one or more acrylate and/or methacrylate monomers each having at least one amide group, urethane group, urea group, or carboxylic anhydride unit and/or ethylene glycol unit, c) from 15 to 95% by weight of an alkyl (meth)acrylate, where the alkyl moiety has from 1 to 14 carbon atoms, where the pressure-sensitive acrylate adhesive comprises one or more 2-(2H-Benzotriazol-2-yl) derivatives admixed as additive; and also a corresponding adhesive.

Use of pressure-sensitive adhesive tapes for optical applications

Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.

Pressure-sensitive adhesive material particularly for encasing an electronic arrangement

The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

Method for encapsulating an electronic arrangement

The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Adhesive tape for encapsulating an organic electronic arrangement

Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B), (A-B)X, or (A-B-A)X, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.

Cross-linkable adhesive compound with hard and soft blocks as a permeant barrier

Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B), (A-B)X, or (A-B-A)X, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and

Temperature-stable cross-linkable adhesive compound with hard and soft blocks

The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.

Adhesive compound and method for encapsulating an electronic arrangement

Laser-inscribable film, comprising a contrast layer based on a cured acrylate coating composition and, arranged above the contrast layer, an engraving layer, where the cured acrylate coating composition is based on a composition comprising from 30 to 80% by weight of a trifunctional oligomer A, from 0 to 20% by weight of a trifunctional monomer B, from 1 to 30% by weight of a difunctional monomer C, and from 2 to 40% by weight of a colorant pigment.

Heat-resistant laser-inscribable film

The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Method of encapsulating an electronic arrangement

The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.

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Hamburg, Germany

Jan Ellinger