Teijin Aramid B.v.

Jan-Cees Tiecken

Frank Diedering

Walter Nijhuis

Ernst Michael Winkler

Antonius Hendriks

Mónica López-Lorenzo

Yen Vu

Antonius J J Hendriks

Adrianus Van Haren

Mónica LÓPEZ-Lorenzo

Antonius JJ Hendriks

An aramid-based paper comprising at least 90 wt. % of aramid material, the aramid material including at least one of aramid shortcut and aramid fibrid, the paper including at most 40 wt. % aramid pulp, calculated on the total amount of aramid material, wherein the paper includes 0.1-10 wt. % of polyamido-amine epichlorohydrin (PAE). It has been found that the incorporation of 0.1-10 wt. % of polyamido-amine epichlorohydrin (PAE) into an aramid-based paper including at least 90 wt. % of aramid material calculated on the weight of the paper not including the PAE, the aramid material including at least one of aramid shortcut and aramid fibrid, the paper including at most 40 wt. % aramid pulp, leads to a surprising improvement of the z-strength and the tear strength of the paper.

Aramid-based paper with improved properties

A process for manufacturing an aramid pulp including polyvinyl pyrrolidone (PVP), the method including the steps of: combining para-aramid short-cut with PVP in an aqueous solution to form a mixture, subjecting the mixture to a refining step to form a para-aramid pulp including PVP. It has been found that the process makes it possible to obtain a PVP pulp with improved dewatering properties and energy consumption in combination with a high PVP retention.

Method for manufacturing aramid pulp comprising PVP

An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.

Aramid paper suitable for use in electronic applications

A friction paper including filler, para-aramid pulp, and resin, characterised in that the para-aramid pulp includes 0.1 to 10 wt. % of polyvinyl pyrrolidone (PVP), the paper having a grammage in the range of 100 to 800 g/m2. It has been found that the use of a PVP-containing para-aramid pulp leads to improved friction performance as compared to the use of para-aramid pulp not containing PVP. Effects obtained include improved friction properties, improved strength properties, and improved filler retention.

Friction material comprising aramid

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Didam, Netherlands

Jan-Cees Tiecken