Texas Instruments Corporation

Jamie T Stapleton

Thomas Warren Lassiter

Maciej Blasiak

Simon Y S Chang

Methods and apparatus for forming structures to reduce wafer warpage. A method includes providing a semiconductor wafer having a plurality of integrated circuits; providing a photomask defining a plurality of cavities to be formed by an etch on a backside surface of the semiconductor wafer; defining structural support areas for the backside surface, the structural support areas being contiguous areas; providing areas on the photomask that correspond to the structural support areas, the structural support areas being areas that are not to be etched; using the photomask, performing an etch on the backside surface of the semiconductor wafer to form the cavities by removing semiconductor material from the backside surface of the semiconductor wafer; and the structural supports on the backside of the semiconductor wafer formed as areas that are not subjected to the etch. Additional methods and apparatus are also disclosed.

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Dallas, TX, United States of America

Jamie T Stapleton