General Electric Company

Lockheed Martin Corporation

Ge Precision Healthcare LLC

Martin Marietta Corporation

James Wilson Rose

Kevin Matthew Durocher

William Edward Burdick, Jr

Jonathan David Short

Renato Guida

Robert J Wojnarowski

Herbert S Cole

John Eric Tkaczyk

Donna Marie Sherman

Ernest Wayne Balch

Leonard Richard Douglas

Michael Gdula

Christopher James Kapusta

Richard J Saia

Arun Virupaksha Gowda

Oliver Richard Astley

Thomas Bert Gorczyca

Raymond Albert Fillion

Peter Micah Sandvik

Rayette Ann Fisher

Evan Taylor Downey

Charles W Eichelberger

Charles Gerard Woychik

Stanton Earl Weaver, Jr

Donald Franklin Foust

Todd Garrett Wetzel

Yanfeng Du

Kenneth Paul Zarnoch

Abdelaziz Ikhlef

Kaustubh Ravindra Nagarkar

Vinayak Tilak

Edward Brittain Stokes

Bernard Gorowitz

Yung S Liu

David Richard Esler

Richard Alfred Beaupre

Stanton Earl Weaver

Charles Adrian Becker

Bradley R Karas

Laura Jean Meyer

Kyung W Paik

Jeffrey Bernard Fedison

Elena Babes-Dornea

Renyan Qin

Paul Jeffrey Gillespie

Gary John Thumann

Donald Leroy Lester

David Michael Hoffman

George E Possin

Samit Kumar Basu

Paul Alan McConnelee

Ching-Yeu Wei

Xiaoye Wu

David Leo McDaniel

Daniel David Harrison

Glenn Scott Claydon

Jianjun Guo

James Scott Vartuli

Naresh Kesavan Rao

Matthew Christian Nielsen

Samhita Dasgupta

James Walter LeBlanc

Nicholas Ryan Konkle

Sergei Ivanovich Dolinsky

Naveen Stephan Chandra

Adrian Ivan

Thomas Francis McNulty

Warren Lee

Wen Li

James Enrico Sabatini

Ashutosh Joshi

Jerome Stephen Arenson

Haochuan Jiang

Christopher David Unger

Manoj Kumar Koyithitta Meethal

Min-Yi Shih

Aparna Chakrapani Sheila-Vadde

Kevin Paul McEvoy

Ronald Frank Kolc

Oded Meirav

Daniel Darcy Doxsee

William V Dumas

Vladimir Anatolievich Lobastov

Sabarni Palit

Theresa A Sitnik

Joe James Lacey

Grant Schueneman

Jeffrey Scott Erlbaum

Jahir Drago

Andrea Jeanne Howard

Michael Anthony Rumsey

Michael James Palleschi

Faisal Saeed

Mathew Christian Nielsen

Xingguang Zhu

Herbert S, Cole, Jr

Lubomry S Onyshkevych

Kevin Mathew Durocher

Richard Joseph Saia

A sensor for a flexible sensor assembly includes a drive coil, a first set of sensing coils, a second set of sensing coils, and a configuration for sensing for discontinuities in a structure desired to be sensed. A method of operating the sensor can include positioning the sensor proximate to the structure, energizing the drive coil, and sensing eddy currents with the sensing coils.

Flexible sensor assembly

An ultrasound transducer array architecture and manufacturing method is provided. The method includes providing an ultrasonic transducer including a plurality of modules, each module including an ultrasonic transducer array and an application specific integrated circuit (ASIC), the ultrasonic transducer array and the ASIC electrically coupled to a flexible interconnect, the flexible interconnect coupled to a connector. The ASIC and flexible interconnect may be arranged such that each ultrasonic transducer array is directly adjacent to another ultrasonic transducer array. The ASIC may be electrically coupled to the flexible interconnect and the ASIC to the transducer array via a redistribution layer. Each of the plurality of modules may be a stack with the ultrasonic transducer array on the RDL and RDL on the ASIC, wherein the flexible interconnect extends laterally from a top surface of the ASIC and curves down to a bottom surface of the ASIC.

Ultrasound transducer array architecture and method of manufacture

Various methods and systems are provided for an imaging detector array. In one example, a detector module of the array has a central slit separating a first tile from a second tile of the detector module. An integrated circuit is located along a first side of the first tile and along a first side of the second tile and flex cable coupled to the integrated circuit of the first portion extends through the central slit of the detector module.

Methods and systems for uniform CT detector heat distribution

An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.

Electronics package having a self-aligning interconnect assembly and method of making same

In certain embodiments, a mixed signal integrated circuit is provided that includes both a digital portion and an analog portion. A shield is provided that overlays one of the digital portion or the analog portion of the mixed signal integrated circuit. The shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit.

Integrated shield structure for mixed-signal integrated circuits

A photon detector having an optical transparent plate and photodiode array interconnected by an optical light guide array. The optical light guide array including elements providing a transmission line between the optical transparent plate and the photodiode array, where the position of one or more optical light guide elements is formed to adjust for a miss-registered photodiode individual element. A method for assembling the photon detector includes depositing a non-wetting film on opposing surfaces of the optical transparent plate and/or photodiode array, altering the deposited non-wetting film in regions of individual photodiode elements, dispensing an optical coupler adhesive on the optical transparent plate and photodiode array to form adhesive beads, aligning the opposing surfaces, assembling the opposing surfaces so that the corresponding optical coupler adhesive beads contact each other, and curing the optical coupler adhesive to form a structurally merged photon detector having optical light guide elements.

Light guide array for pet detector fabrication methods and apparatus

Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced. The co-location of the electronics next to or proximal to the photodetector array also enables/facilitates programmable pixel configuration for optimal image quality.

Integrated diode DAS detector

The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.

Reconfigurable electronic substrate

Embodiments of a photodiode array are provided herein. In some embodiments, a photodiode array may include a semiconductor layer configured to convert photons into analog electrical signals; and a passive layer having a first surface and a second surface disposed opposite the first surface, wherein the semiconductor layer is coupled to the first surface, and wherein the passive layer is configured to have a signal receiving component coupled directly to the second surface of the passive layer.

Photodiode array for imaging applications

A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board.

Circuit board including mask for controlling flow of solder

Detector modules for an imaging system and methods of manufacturing are provided. One detector module includes a substrate, a direct conversion sensor material coupled to the substrate and a flexible interconnect electrically coupled to the direct conversion sensor material and configured to provide readout of electrical signals generated by the direct conversion sensor material. The detector module also includes at least one illumination source for illuminating the direct conversion sensor material.

Detector modules for imaging systems and methods of manufacturing

A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.

Detector array with a through-via interposer

An interface circuit for a sensor array is provided. The interface circuit may be made up of an integrated circuit package that provides a first region and a second region. The first region may be spaced apart and opposite to the second region of the package. The first region of the package may provide a plurality of interfaces for interconnecting to an integrated circuit in the package a plurality of signals from the sensor array and having a first electrical characteristic, such as analog and test signals. The second region of the package may provide a plurality of interfaces for interconnecting to the integrated circuit a plurality of signals having at least one electrical characteristic different than the first characteristic, such as power and operational digital signals.

Electrical interface for a sensor array

A scintillator array and method for making the same are provided. The array comprises a bi-layer reflector further comprising a conformal smoothing layer and a mirror layer. The bi-layer reflector does not comprise an intervening reducing agent or adhesion layer and/or comprises aluminum. Further, the mirror layer may be deposited via gas phase metallization, allowing application to tightly confined spaces. A detector array comprising the scintillator array is also provided.

Scintillator arrays and methods of making the same

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Guilderland, NY, United States of America

James Wilson Rose