Lucent Technologies Inc.

Agere Systems Inc.

Agere Systems Guardian Corp.

James W Blatchford, Jr

Brittin C Kane

Stanley K Pau

Simon John Molloy

Kurt George Steiner

Nace Layadi

John Martin McIntosh

Omkaram Nalamasu

Scott Jessen

Sidelobe formation in photolithographic patterns is suppressed by non-rectangular, non-circular contact openings formed in attenuated phase shift photomasks. The contact openings may be diamond-shaped, star-shaped, cross-shaped, or various other shapes which include multiple vertices. The contact opening shapes may include only straight line segments or they may include rounded segments. The contact openings may be arranged in various relative configurations such as in arrays in which the contact openings are sized and spaced by sub-wavelength dimensions. A method for forming contact openings on a photosensitive film uses the attenuated phase shift photomask to form a contact pattern free of pattern defects. A computer readable medium includes instructions for causing a photomask manufacturing tool to generate the attenuated phase-shift photomask.

Suppression of side-lobe printing by shape engineering

A method for analyzing a semiconductor surface having patterned features on the surface is disclosed. At least one patterned feature is scanned to produce a scanned waveform signal having signal segments corresponding to characteristic surface portions of the patterned feature. The signal segments are processed using an auto-correlation function to produce an auto-correlation signal for each characteristic surface portion of the patterned feature. A reference signal having signal segments corresponding to characteristic surface portions of a known patterned feature is provided and each segment of the auto-correlation signal is compared to the respective signal segments of the reference signal.

Method analyzing a semiconductor surface using line width metrology with auto-correlation operation

The invention is a method for forming semiconductor devices from a substrate having a non-planar surface. An anti-reflection coating is formed between the substrate and photoresist layer to alleviate the problems caused by non-uniform reflection at the substrate surface during exposure of the photoresist layer. Three-layer and two-layer stacks are described for use with UV and i-line exposure.

Method for fabricating semiconductor devices

Growing community of inventors

Orlando, FL, United States of America

James W Blatchford, Jr