Applied Materials, Inc.

James V Santiago

Patricia M Liu

Damian W Sower

Embodiments of the present disclosure generally relate to an apparatus and method of processing a substrate. In at least one embodiment, an apparatus includes a chamber body, a substrate support assembly and a bracket assembly disposed outside the chamber body and coupled to the substrate support assembly. The bracket assembly has a plurality of leveling screws for adjusting a level of the substrate support assembly. The apparatus includes an actuator coupled to one of the plurality of leveling screws and an accelerometer coupled to the substrate support assembly. The accelerometer is configured to indicate an orientation of the substrate support assembly. The apparatus includes a control module in communication with the actuator and the accelerometer. The control module is configured to determine the level of the substrate support assembly based on the orientation indicated by the accelerometer and adjust the level of the substrate support assembly using the actuator.

Level monitoring and active adjustment of a substrate support assembly

A processing chamber with a flow-restricting ring is generally provided. In one embodiment, a processing chamber includes a chamber body, a lid assembly, a substrate support and a flow-restricting ring. The chamber body has sidewalls and a bottom. The lid assembly is disposed on the sidewalls and encloses an interior volume of the chamber body. The substrate support is disposed in the interior volume of the chamber body and is adjustable in elevation between the lid assembly and the bottom of the chamber body. The flow-restricting ring has an outer edge disposed proximate the sidewalls of the chamber body and an inner edge disposed proximate the substrate support when the substrate support is disposed in an elevated position. The inner edge of the ring and the substrate support are disposed in a spaced-apart relation defining an annular flow control orifice. The flow control orifice disposed proximate the substrate support enhances flow uniformity across the diameter of a substrate seated on the substrate support during processing.

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Santa Clara, CA, United States of America

James V Santiago