Dell Products Inc.

Chatsworth Products, Inc.

Intel Corporation

James Utz

Andrew Thomas Sultenfuss

Eduardo Escamilla

William Drew Krietzman

Joshua James Young

Anderson Hungria

Kevin Warren Mundt

Ayedin Nikazm

Larry William Finn

Baomin Liu

Karlene Berger

David Loadman

Kyle D Spiess

Songnan Yang

Ulun Karacaoglu

Corey Dean Hartman

Munif Farhan

Ralph V Miele

Ben John Sy

Robert Boyd Curtis

Chung-Hao Chen

Leo Joseph Gerten

Gary S Thomason

Johnny C Fraga

Bin Xiao

Andrew Larson

Tongyan Zhai

James M Yoder

Steven L Williams

Drew G Damm

Meenakshi Gupta

Venkat R Gaurav

Brian R Peil

Matthew Dang

James Gossett

Ron Langerhans

Bilal Ahmed

Jorge C Marcet

Chase Berry

Dennis Andre Burrell

Jeffrey R Taus

Zachary A Cravens

Leslye Paniagua Sanchez

Ricky O Branner

Ed Ho Sung Chun

Adam Kelly

A modular device bay mounting system. The modular device bay mounting system includes a front bay component; a rear bay component; and, a mid bay component extending from the front bay component to the rear bay component, the mid bay component comprising a modular adapter component, the modular adapter component comprising: a mid bay adapter base structure, the mid bay adapter base structure being configured to be mounted to a base plate of the mid bay component; and, a mid bay latch device, the mid bay latch device being pivotally mounted to the mid bay adapter base structure; and wherein when the mid bay adapter base plate is not mounted to the base plate of the mid bay component, the modular device bay mounting system is configured to receive a double wide form factor device.

Server system drive mounting system including a network controller mounting bracket

A bench clip for a liquid cooling system is disclosed. The bench clip comprises a manifold attached to a liquid coolant fitting. A retention bracket has a first slot that is adapted to receive a tab on the manifold. The retention bracket has a second slot oriented perpendicular to the first slot. A handle is pivotably mounted to a post on the manifold. The handle has a post positioned within the second slot on the retention bracket. The manifold tab is configured to slide within the first slot and the handle post is configured to slide within the second slot in response to movement of the handle. Movement of the manifold tab within the first slot limits the movement of the manifold to a single axis relative to the clip. An attachment end of the retention bracket is configured to engage with a portion of a server chassis.

Liquid cooling bench clip

Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, computing devices may use data stored in storage devices. When using the data stored on the storage devices, the storage devices may generate heat. To manage the heat generated by the storage devices, the storage devices may be positioned within housing structures that facilitate dissipation of the heat. Once positioned within the housing structures, the housing structures may be positioned within a module that facilitates operable connection with a storage controller while simultaneously enhancing the dissipation of the heat. The storage controller may manage the data stored on the storage devices to provide the computer implemented services.

System and method for modular hard drive enclosure with device cooling

Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, hardware resources available to data processing systems may be customized. The hardware resources may be customized through addition or replacement of interchangeable hardware components. The interchangeable hardware components may include features that may improve the likelihood of successfully adding or replacing the interchangeable hardware components.

System and method for reversible connection of interchangeable components

A device heater module can be installed within a device such as a server, and can prevent the device from powering on while the temperature of the device is being restored to an operating temperature. The device heater module can prevent the device from powering on by operating a switch to disconnect the device from an external power supply. The device heater module can thereafter actively or passively modify the temperature of the device. After the temperature of the device is restored to within the operating temperature, the device heater module can operate the switch to reconnect the device to the external power supply, thereby allowing the device to initiate a boot process.

Device heater module

A method for providing thermal control of an information handling system may include in response to a request to power on the information handling system, in order to pre-condition a temperature associated with the information handling system to within a desired temperature range, receiving an indication of a temperature associated with the information handling system and based on the indication of the temperature associated with the information handling system, control the one or more temperature control elements for regulating a liquid of a liquid thermal control system to cause the temperature associated with the information handling system to fall within the desired temperature range prior to full powering on of the information handling system.

Systems and methods for pre-conditioning system temperature using liquid

An information handling system may include a chassis including a drive bay configured to receive a data storage device. A pre-heater installed at the drive bay may include a first power connector configured to mate with a corresponding power connector included at the drive bay, and configured when operating to increase a temperature of the information handling system to a predetermined level prior to initializing the information handling system for computational operation.

System pre-heater having data storage drive form-factor and method therefor

Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.

Thermal cooling system

A cable retention system for a power distribution unit includes a tether and a tether mount. The tether has an elongate portion and an attachment portion, and the attachment portion includes a channel therein. The tether mount has a base at a proximal end and a head at a distal end. The base is adapted to attach the proximal end of the tether mount to the power distribution unit. The tether is adapted to be secured to the tether mount by snap-fitting the head of the tether mount into the channel of the attachment portion.

Cable retention system for power distribution unit

Illustrative examples include a docking system for a foldable electronic device such as a 2-in-1 convertible computer. The docking system may include a housing having an engagement surface to interface with a portion of the foldable electronic device when the foldable electronic device is operably engaged with the docking system. The engagement surface may include a vent opening arranged to direct airflow in between a first portion and a second portion of the plurality of portions, and a separator to maintain separation between the first portion and the second portion when the foldable electronic device is operably engaged with the engagement surface. A blower coupled to the housing may supply airflow through the vent opening.

Docking systems and methods for electronic devices

Technologies for hinges on mobile compute devices with dual screens are disclosed. In the illustrative embodiment, the mobile compute device with two housings each having a display are connected to each other by a hinge with elliptical spur gears that allow for one housing with a display to be rotated 360 degrees relative to the other housing. The elliptical shape of the spur gears allows the separation between the gears to change as one housing is rotated and, in particular, allows a smaller separation between the gears in certain configurations of the mobile compute device. The illustrative hinge includes a mechanical linkage system that allows the hinge to expand and contract as one housing is rotated.

Technologies for hinges for dual screen devices

Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.

Mobile device cooling and performance management

A board-mounted circuit breaker assembly for an electronic equipment enclosure includes a printed circuit board having a plurality of quick-connect terminals and a circuit breaker. The circuit breaker includes a housing and a plurality of quick-connect terminals that are at least partially recessed into a portion of the housing to reduce the overall 'z'-height of the circuit breaker. The quick-connect terminals on the circuit breaker are adapted to mechanically and electrically connect to the quick-connect terminals on the printed circuit board.

Board-mounted circuit breakers for electronic equipment enclosures

Growing community of inventors

Round Rock, TX, United States of America

James Utz