Henkel Corporation

Designer Molecules, Inc.

James T Huneke

Stephen M Dershem

Puwei Liu

Kang Yang

Farhad G Mizori

Qing Ji

Benedicto Delos Santos

Michael George Todd

Lawrence N Crane

Gordon C Fischer

The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

Materials and methods for stress reduction in semiconductor wafer passivation layers

A method of forming a bonded shingle stacked die package is provided. The method includes providing a wafer, singulating the wafer into a plurality of strips, applying to at least a portion of at least one mating surface of each of the plurality of strips a material capable of reacting with the other mating surface, stacking the plurality of strips in an overlapping stair-step configuration, exposing the stacked strips to conditions sufficient to bond the plurality of strips together, and dicing the stacked strips into individual die shingle stack configurations.

Methods of dicing stacked shingled strip constructions to form stacked die packages

Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Interlayer dielectric and pre-applied die attach adhesive materials

Growing community of inventors

San Diego, CA, United States of America

James T Huneke