Rohm & Haas Electronic Materials LLC

Tokai Carbon Company, Ltd.

James T Fahey

Robert K Barr

James G Shelnut

Corey O'Connor

Jitendra Singh Goela

Michael A Pickering

Melinda S Strickland

John J Piskorski

Semiconductor processing and equipment are disclosed. The semiconductor equipment and processing provide semiconductor wafers with reduced defects.

Semiconductor processing

An imaging composition, article and method of imaging are disclosed. The imaging composition is energy sensitive such that upon application of a sufficient amount of energy to the composition a color or shade change is affected. The imaging composition is coated on an article to form an energy sensitive article, which may be used in marking work pieces.

Imaging compositions and methods

An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Imaging methods

Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be used in methods of marking.

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Mendon, MA, United States of America

James T Fahey