Dow Corning Corporation

Dow Silicones Corporation

Dow Corning (china) Holding Co., Ltd

James Steven Tonge

Afrooz A Zarisfi

Gary Michael Diamond

Keith Hall

Richard G Taylor

Loren D Lower

Ming-Shin Tzou

Avril E Surgenor

Kurt Friedrich Brandstadt

Simon Cook

Nick Evan Shephard

Loren D Durfee

Timothy Paul Mitchell

Yin Tang

Brian Douglas Chapman

John Donald Blizzard

Lauren Marie Tonge

Khristopher Edward Alvarez

Kristen E Steinbrecher

Glenn Gordon

James Shoemaker

Paul Vandort

Paul Cornelius Van Dort

Jing Jiang

Thomas W Galbraith

Karmen Karen Asch

Robert Michael Hensel

Lei Fang

Dongchan Ahn

Gary A Vincent

Brian Harkness

Kai Su

Xiucuo Li

Kent R Larson

Lori Ann Stark-Kasley

Dipak B Narula

Thomas Bekemeier

William Kenneth Weidner

Stanton James Dent

Patricia Ann Olney

Loretta Ann Jones

Leroy Elton Thayer

Karen L Hueston

Michael J Brasseur

Arianne Tan

Donna R Gray

Arne R Jarnholm

Cheryl Lynn Loch

Adrienne Bowman

Roger Romain

Kent Larson

Kurt Brandstadt

Avril Surgenor

Karen Hueston

A method for forming a thermally conductive thermal radical cure silicone composition comprising (I) a clustered functional polyorganopolysiloxane; optionally (II) a silicone reactive diluent, (III) a filler comprising a thermally conductive filler, (III') a filler treating agent, and (IV) a radical initiator is provided. In this method, the clustered functional polyorganosiloxane (I) and the optional silicone reactive diluent (II) are premade prior to their addition to respective components (III), (III&#x2032;) and (IV).

Method for forming thermally conductive thermal radical cure silicone compositions

A moisture-curable silicone adhesive composition is provided that comprises (A) a reactive resin, (B) a reactive polymer, (C) a moisture cure catalyst, and (D) a crosslinker resin. The reactive resin (A) comprises the reaction product of a reaction of an alkenyl-functional siloxane resin comprising RSiOunits and SiOunits and an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom in the presence of a hydrosilylation catalyst. The reactive polymer (B) comprises the reaction product of a reaction of an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom and a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a hydrosilylation catalyst.

Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin

A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiH/Viratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Clustered functional polyorganosiloxanes, processes for forming same and methods for their use

An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising RSiOunits and SiOunits; (ii) an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom at a molecular terminal; (iii) an endcapper according to the formula to the formula RSi&#x2014;(RSiO)&#x2014;SiRH or RSi&#x2014;(RSiO)&#x2014;(HRSiO)&#x2014;SiR, or combinations thereof; and (iv) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a (v) hydrosilylation catalyst. In this alkoxy-functional organopolysiloxane resin and polymer, each Ris independently a hydrocarbon radical and the subscripts s and t independently have values ranging from 0 to 10.

Alkoxy-functional organopolysiloxane resin and polymer and related methods for forming same

A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents

A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

Stable thermal radical curable silicone adhesive compositions

An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

In situ method for forming thermally conductive thermal radical cure silicone composition

A hydrosilylation process is used to prepare a polyorganosiloxane having clustered functional groups at the polyorganosiloxane chain terminals. The ingredients used in the process include a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule and at least 4 silicon bonded hydrogen atoms for each aliphatically unsaturated organic group in ingredient a), c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more curable groups; and d) a hydrosilylation catalyst. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Process for preparing clustered functional polyorganosiloxanes, and methods for their use

A composition is capable of curing via condensation reaction. The composition uses a new condensation reaction catalyst. The new condensation reaction catalyst is used to replace conventional tin catalysts. The composition can react to form a gum, gel, rubber, or resin.

Titanium containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts

Filled silicone composition, in situ preparation and use thereof are provided. The composition comprises a mixture of (A) an in situ-prepared treated silica, (B) an in situ-prepared (siloxane-alkylene)-endblocked polydiorganosiloxane, (c) a cure catalyst and (D) a crosslinker. Moreover, the composition can be used as adhesive, coating and sealant.

Filled silicone composition, in situ preparation and use thereof

Iron(III) containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts

Zirconium containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts

Iron(II) containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts

Zinc containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts

A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (RSi0), (RSi0), (SiO), (R'), and (RSi0), where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3. 

Dual curing polymers and methods for their preparation and use

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Sanford, MI, United States of America

James Steven Tonge