International Business Machines Corporation

James Steven Kamperman

David Brian Stone

Thomas P Gall

James Robert Wilcox

Anthony P Ingraham

Jerome A Frankeny

Frank Daniel Egitto

Natalie Barbara Feilchenfeld

Elizabeth F Foster

David Erle Houser

Stephen Joseph Fuerniss

Ernest Bassous

Michael J Canestaro

Jeffrey D Jones

Gobinda Das

Michael R Scheuermann

Robert Douglas Edwards

Steven L Bard

Jack M McCreary

Donald J Mikalsen

Edward Jay Frankoski

Gerald A Bendz

Warren R Wrenner

Paul S Gursky

Michael S Horan

John R Chapura

John R Kjelgaard, Jr

A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material. The at least one core includes a plurality of placed through holes formed therethrough. At least one pad is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device and also prevents solder from entering the at least one plated through hole.

Process for forming multi-layer electronic structures

Disclosed is a sculpted probe pad and a gray scale etching process for making arrays of such probe pads on a thin flexible interposer for testing the electrical integrity of microelectronic devices at terminal metallurgy. Also used in the etching process is a novel fixture for holding the substrate and a novel mask for 1-step photolithographic exposure. The result of the invention is an array of test probes of preselected uniform topography, which make ohmic contact at all points to be tested simultaneously and nondestructively.

Gray scale etching for thin flexible interposer

A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material. The at least one core includes a plurality of plated through holes formed therethrough. At least one pad is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device and also prevents solder from entering the at least one plated through hole.

Process for forming multi-layer electronic structures including a cap

A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer having a dielectric substrate and a device contact face and a tester contact face is provided. A first plurality of releasable connectors on the device contact are face arranged in the same predetermined pattern, and a second plurality of releasable connectors are arranged in the same predetermined pattern on the tester contact face. The releasable connections are formed of dendrites. Conducting vias connect the corresponding connectors of the first and second releasable connectors respectively. A test head is provided having a plurality of contact pads also arranged in the same predetermined pattern. Circuitry is provided on the test head to connect each of the contact pads thereon with external leads extending to provide signal contact to each of the contact pads on the test head. The interposer is positioned between the IC device and the test head, with the contacts on the IC device in contact with the first plurality of connectors and the contact pads on the test head in contact with the second plurality of connectors. Signals are provided to the connector pads from the electrical leads for performing testing and/or burn-in of the integrated circuit device. The testing is performed at elevational temperatures. A test head structure is also disclosed.

Apparatus and method for burn-in/testing of integrated circuit devices

Test head for applying signals in a burn-in test of an integrated circuit

A process of forming a multi-layer electronic composite structure. At least one core including at least one functional plane of at least one electrically conducting material having a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material is provided. The at least one core includes a plurality of plated through holes formed therethrough. A pad of an electrically-conducting material is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device. The pad also prevents solder from entering the at least one plated through hole. Additionally, the pad provides an electrical connection between the electronic device and the at least one core.

Cap providing flat surface for DCA and solder ball attach and for

A cap for attaching a chip or other device to a multi-layer electronic structure. The cap includes a plurality of pads of an electrically-conducting material attached over plated through holes of the multi-layer electronic structure. Each of the pads includes a flat upper surface for attaching the chip or other device to the multi-layer structure, provides an electrical connection between the chip or other device and the multi-layer structure, and seals the through holes to prevent solder from entering the plated through hole. The pads are physically isolated from each other.

A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.

Fluid treatment apparatus

Disclosed is a method of producing vias and through holes through a metal laminate. The laminate is a multi-layer, for example, a trilayer of a relatively hard metal between two layers of a relatively soft metal. The method includes the steps of first etching a clearance hole through the soft metal on one side of the trilayer laminate, followed by partially etching the hard metal layer. Next, drilling the remaining thickness of the hard metal, and drilling through the second layer of soft metal.

Method of drilling vias and through holes

A fixture for mounting a flexible film electronic device carrier on or for separating the carrier from a substrate which includes a body portion that has a cavity deep enough to contain an electronic device attached to the carrier, a perimeter for contact with a lead bonding area of the film, a surface having openings through which a vacuum can be drawn for holding the flexible film carrier and electronic device attached thereto in the cavity, and a heating element in the perimeter of the body portion; and use thereof to mount a carrier on to separate a carrier from a substrate.

Method and apparatus for mounting a flexible film electronic device

Growing community of inventors

Endicott, NY, United States of America

James Steven Kamperman