Raytheon Company

James Stephen Mason

James S Wilson

Timothy C Fletcher

Thomas H Taylor

Matthew D Brown

John Michael Bedinger

Joel C Roper

Richard W Nichols

Raymond Dean Eppich

Gilbert M Shows

Raj Rajendran

Gustavo A Burnum

Kenneth William Brown

Andrew Kent Brown

William Earl Dolash

Darin M Gritters

Michael John Sotelo

Thomas Lee Obert

Christian O Hemmi

Ike Chang

Ronald J Richardson

Domingo Cruz-Pagan

Joseph Robson

Rafael Quintero

Erika Ramirez

Jonathan Schmidt

Lucian A Braiser

Angel Crespo

In one embodiment, a hermetic covering system includes a projectile and at least one bag. The projectile has a body and a component that houses moisture-sensitive equipment. The at least one bag may be coupled to the body such that the projectile protrudes through the opening and the component is disposed in the inner cavity to protect the component during storage of the projectile.

Hermetic covering system and method for a projectile

An electronically scanned array antenna. The novel antenna includes a first planar array of antenna elements and one or more side planar arrays of antenna elements, each side array adjacent to the first array and tilted at a predetermined angle relative to the first array. In an illustrative embodiment, the antenna also includes a plurality of transmit/receive modules, each module coupled to one antenna element. Each transmit/receive module includes phase shifters for varying the relative phases of the antenna elements to form a desired overall beam pattern, and a low noise amplifier and high power amplifier for amplifying signals received and transmitted by the antenna element, respectively. In an illustrative embodiment, a processor provides individual phase and channel enable control signals for independently controlling the phase shifters and amplifiers, respectively, of each module.

Active electronically scanned array antenna for satellite communications

A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

Lens array module

A partitioned aperture array antenna. The novel antenna includes a first subarray having a first number of antenna elements equipped with transmit functionality and a second subarray having a second number of antenna elements equipped with receive functionality, wherein the first and second numbers are not equal and the first and second subarrays have at least one common antenna element. In an illustrative embodiment, the first subarray includes a transmit circuit coupled to each antenna element in the first subarray for controlling a relative transmit phase of the antenna element to steer an overall antenna transmit beam, and the second subarray includes a receive circuit coupled to each antenna element in the second subarray for controlling a relative receive phase of the antenna element to steer an overall antenna receive beam.

Partitioned aperture array antenna

According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.

Reduced inductance interconnect for enhanced microwave and millimeter-wave systems

In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Air cooling for a phased array radar

Adjusting a calibrated phased array includes receiving conditions data describing conditions at a phased array. The phased array comprises antenna element sets, where an antenna element set comprises antenna elements and is associated with a calibration value. The following is performed for each antenna element set. A temperature value is established for an antenna element set according to the conditions data. A temperature-dependent correction value corresponding to the temperature value is established. A correction value is determined for the antenna element set according to the temperature-dependent correction value and the calibration value associated with the each antenna element set. At least one antenna element of the antenna element set is adjusted according to the correction value.

Dynamically correcting the calibration of a phased array antenna system in real time to compensate for changes of array temperature

According to an embodiment of the present invention, a subassembly for a phased array radar includes a substrate generally lying in a first plane, the substrate including a plurality of transmit/receive modules coupled to a mounting surface and a plurality of radiating elements formed adjacent the mounting surface, and a multi-function board generally lying in a second plane parallel to the first plane. The multi-function board is in spaced apart relation to the substrate and may include RF manifolding and logic/power distribution functions for the transmit/receive modules.

Subassembly for an active electronically scanned array

In one embodiment, a polarization control system for an antenna array comprises a number of first and second antenna elements and a beam forming network. The first antenna elements have a direction of polarization that is different from a direction of polarization of the second antenna elements. The beam forming network, which is coupled to the first and second antenna elements, is operable to provide a second signal to a first subset of the plurality of first antenna elements that is different from a first signal that is provided to the other first antenna elements and provide a third signal to a second subset of the second antenna elements that is different from the first signal that is provided to the other second antenna elements.

Polarization control system and method for an antenna array

According to an embodiment of the present invention, a multi-function carrier structure for a phased array radar includes a substrate that includes a mounting surface for a plurality of transmit/receive modules, a plurality of radiating elements integrally formed in the substrate adjacent the mounting surface, and a plurality of cooling channels integrally formed within a thickness of the substrate. The substrate is formed from a material having a coefficient of thermal expansion similar to respective substrates of the transmit/receive modules.

Integrated subarray structure

According to an embodiment of the present invention, a transmit/receive module for a phased array radar includes a substrate, a ground plane formed outwardly from the substrate, and one or more dielectric layers formed outwardly from the ground plane. The one or more dielectric layers have RF and DC routing formed therein. The transmit/receive module further includes an electronic device coupled outwardly from the one or more dielectric layers, and a lid coupled to a portion of the one or more dielectric layers.

Transmit/receive module and method of forming same

An apparatus includes a plurality of Transmit/Receive (T/R) modules () coupled with a slat assembly (). The slat assembly includes a fluid passageway (). A plurality of turbulence inducing structures () are disposed within the fluid passageway. In one embodiment, the turbulence inducing structures includes constrictions () extending from a surface () of the fluid passageway. The location and configuration of the structures is selected to achieve a predetermined temperature profile along the passageway, in response to fluid flow through the fluid passageway.

Growing community of inventors

Richardson, TX, United States of America

James Stephen Mason