Cree Gmbh

James Seruto

Bernd P Keller

Eric J Tarsa

James Ibbetson

Arpan Chakraborty

Ashay Chitnis

Yankun Fu

John Adam Edmond

David T Emerson

Michael John Bergmann

Jeffrey Carl Britt

Jasper S Cabalu

Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

Wafer level phosphor coating method and devices fabricated utilizing method

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Goleta, CA, United States of America

James Seruto