International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

James Scott Womble

Richard M Barina

Derek Ian Schmidt

Daniel Paul Kelaher

Mark Edward Steinke

Vinod Kamath

Timothy Andreas Meserth

Jeffrey Scott Holland

Chunjian Ni

Leo H Webster

Jim Drake

Eric Alan Eckberg

Brian Michael Kerrigan

Michael Raymond Miller

Gerhard Ingmar Meijer

Roland Kamakau Alo

Glenn Edward Myrto

Norman Bruce Desrosiers

Michael Charles Elles

Tu T Dang

Alvin G Davis

Robert Mark Lindsay

James Robert Drake

George M Moorefield, Ii

Jean Jidong Xu

Ketan B Patel

Robert L Ayers

Devices and methods for adjusting the position of liquid cooling system infrastructure of a computing system comprising liquid-cooled memory modules to provide improved systems and techniques for servicing liquid-cooled memory modules are disclosed herein. According to an aspect, a device includes a table section, a handle on a first side of the table section, and a spreader section on a second side of the table section opposite from the first side, the spreader section further comprising a profile. The profile of the spreader section comprises a first pair of a flat surfaces parallel to each other, defining a first width. The profile of the spreader section further comprises a second pair of flat surfaces parallel to each other, defining a second width perpendicular to the first width, the second width being longer than the first width. The profile of the spreader section also comprises a pair of curved transition sections on opposite corners of the profile, each transition section configured to controlled adjustment with progressive incremental radius increments between an adjacent surface from each of the first pair and second pair of surfaces, such that the device is adapted to insertion with respect to a gap between cooling elements of a double-sided memory module cooling system, and is configured to be rotated to adjust the position of the cooling elements.

Liquid cooled memory module service device for systems with multiple memory module thicknesses and methods of using the same

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same

According to one embodiment, a method for placing an adapter card on a system board of a computer system includes, aligning a tool having an adapter card secured therewith to a slot on a system board of a computer system using a positioning member, and seating the adapter card into the slot on the system board. The tool includes a carrier for supporting the adapter card, at least one lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, at least one upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier, and the positioning member coupled to the carrier.

Internal PCI adapter card carrier

An apparatus includes a rigid structure having first and second collars, a quick connect connector having first and second shoulders, and a spring biasing the connector toward an extended position with the first shoulder against the first collar and the second shoulder against the second collar. The first collar and the first shoulder form an inwardly and rearwardly angled contact surface there between, and the second collar and the second shoulder form an inwardly and rearwardly angled contact surface there between. The connector is centered in the first and second collars unless acted upon by a force overcoming the spring and pushing the connector to a retracted position with the first and second shoulders out of contact with the first and second collars. When retracted, the connector may adjust its position longitudinally, vertically, laterally or angularly to facilitate coupling with a mating fixed quick connect connector.

Blind docking apparatus to enable liquid cooling in compute nodes

A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Liquid cooling of multiple components on a circuit board

An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.

Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

Liquid-cooled memory system having one cooling pipe per pair of DIMMs

A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

User-serviceable liquid DIMM cooling system

A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Liquid-cooling memory modules with liquid flow pipes between memory module sockets

A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.

Tool for installation and removal of semiconductor device

A dual-sided connector pin interposer includes a substrate comprising a first side opposite a second side. The interposer includes a first plurality of flexible pins protruding from the first side of the substrate. The first plurality of flexible pins is positioned for installation in a first plurality of pad connectors of the pinless socket. The interposer includes a second plurality of flexible pins protruding from the second side of the substrate. The second plurality of flexible pins is positioned for installation in a second plurality of pad connectors of the pinless integrated circuit component. The first plurality of flexible pins are electrically connected to the second plurality of flexible pins through the substrate to provide electrical contact points between the pinless socket and the pinless integrated circuit component when the interposer is installed.

Removable and replaceable dual-sided connector pin interposer

A method and system to support simultaneous unlatching from a rack of two or more adjacently mounted and vertically aligned hardware components. One interface bracket is secured to one vertical rail of the rack, and a second interface bracket is secured to a second vertical rail of the rack on an opposite side of the rack. A set of latches are provided in communication with each interface bracket, with the number of latches corresponding to the number of hardware components in communication with the interface bracket. Actuation of one of the latches releases fastening of at least one hardware components from the rack, and accommodates removal of the release component from the rack.

Latching system for multiple nodes of a computer system

A modular electronic system including a mechanism for releasably securing a modular device within a chassis, and for facilitating insertion and removal of the modular device. One embodiment provides a modular device that includes a handle secured to opposing pivotable lever arms. A follower pin secured to one end of the lever arms rides in a slot defined by the chassis. The slot is arranged so that pulling upward on the handle moves the follower pin in one direction along the slot to urge the modular device in a direction further into the device bay, and pushing downward on the handle urges the modular device in a direction out of the device bay, thereby providing a mechanical advantage to the user. When the modular device is fully inserted, retractable locking members provided on the modular device move into windows provided on the chassis, to releasably lock the modular device in the device bay. A module release mechanism includes a release plate that moves into engagement with a sloped or ramped surface of the locking members in response to squeezing the handle. Engagement of the release plate with the ramped surface moves the locking members inward and out of the windows on the chassis, to unlock the modular device from the device bay.

Mechanically-assisted insertion and removal of modular device

An air moving device assembly in a computer system has an air moving device such as a fan or blower within a housing for moving air from an air inlet to an air outlet. A mesh with a plurality of openings covers the air outlet. A back flow damper assembly is positioned over the air outlet. The back flow damper assembly further comprises at least one damper door movable in an open position and a closed position. The damper door has at least one tooth such that when the damper door is in the closed position, the tooth interacts with at least one of the plurality of openings in the mesh. By periodically cycling the air moving device controlled by device management software, the teeth will close and open, loosening debris from the mesh, allowing the debris to be blown out the rear of the housing once the device is turned back on.

Self-brushing air moving device

An information control panel and hinge member is removably joined together as a single unit to a retractable shuttle device utilized with computer servers or processor-based devices. The shuttle device having a first central opening with plural spaced apart detent grooves positioned thereabout. The hinge member includes a second central opening with plural spaced apart tabs positioned thereabout. A screw fastening element positioned through the first and second openings to directly and rotatably secure the hinge member relative to the shuttle device. A latch release means permits the single unit to be easily positioned in plural horizontal and vertical orientation positions that moves between selective ranges of 0 degrees to 90 degrees as the tabs moves relative to the detent grooves. Also, at least a stop member is located on the hinge member adjacent one of the tabs to stop the single unit at the minimum and extreme orientation positions.

Growing community of inventors

Hillsborough, NC, United States of America

James Scott Womble